Content

Introduction

Executive summary

Acronyms & definitions

LED market status

·         Market segmentation

·         Market Volume

·         Market Revenue

·          General Lighting

·         GaN-based White LEDs

·         Wafer Needs for General Lighting

LED Performance

·         Lumens. Depending on Applications

·         Internal Quantum Efficiency

·         Evolution Under High Current

·         Output Heat

·         Overall Performances

·         Expected Performances for White LED

LED Packaging Status

·         Introduction

·         Package families

·         Assembly Process Flow

o    Definitions

o    Description

o    System Integration

o    Challenges

o    Value Chain

o    Evolution

o    Trends

·         Technology Roadmap

Packaging of Regular LED

·         Flow Chart for Regular LED

o    Main steps and materials

o    Standard Assembly Flow

o    Through Hole Devices

o    Surface Mount Devices

o    Market Metrics - Packaged LED Market Volume

·         DICING

o    Location of Dicing Process

o    Saw Dicing

o    Laser Dicing

o    Saw VS Laser

o    Supply Chain

o    Market Volume for Sapphire Wafers

o    Market Revenue for Dicing Services

o    Market of equipments in number of units

o    Market in $M

·         DIE BONDING

o    Location of the process

o    The Basics

o    Dispensing equipment from Asymtek

o    Material for LED

o    Main players

o    Market Volume for Die Attach Material

o    Market Revenue for Die Attach Material

o     Market of equipments in number of units

o     Market of equipments in $M

·         INTERCONNECT

o    Location of the process

o    Overview of wire bonding

o    Electrical connection : the basics

o    Wire Bonding Processes

o    Ball bonding VS Wedge bonding

o    Ribbon bond VS wire bond

o    Main players

o    Market revenue - Assumptions

o    Market revenue for gold wire bonding

·         ENCAPSULATION, LENS & PHOSPHOR

o    Location of the process

o    Encapsulation method for LED lamp

o    Casting process for encapsulation

o    Encapsulation for SMD

o    Compression molding process

o    Materials for encapsulation

o    Market estimation of molding compound

o    How does LED generate white light?

o    Phosphor chemistry

o    Phosphor placement in white LED

o    Main phosphor technologies in use

o    Main phosphor suppliers

o    Optics

o    Main players

o    Market revenue for phosphor material

·         CONCLUSIONS

PACKAGING OF HB/UHB LED

·         Introduction

·         What package for what LED?

·         Package type

·         Evolution of the packaging

·         Impact of the heat

·         HB/UHB LED packaging function

·         Different levels of packaging

·         Considerations of HB LED design

·         Materials challenges and solutions

·         Market Metrics - Packaged LED Market Volume

·         SCRIBING AND DICING

o    Location of the process

o    Scribing & Dicing: Definition

o    Techniques, Throughputs and Costs

o    Number of dice / wafer

o    Laser Scribing & Dicing

o    Diamond Scribing & Dicing

o    Example of JPSA Scribing & Dicing tool

o    Example of NWR Scribing & Dicing tool

o    Laser Microjet Technology from Synova

o    Example of Synova Scribing & Dicing tool

o    Example of Oxford Lasers Scribing & Dicing tool

o    Example of ALSI Lasers Dicing tool

o    Stealth Dicing Technology

o    Stealth Dicing Roadmap

o    Example of Stealth Laser Dicing tool

o    Example of Jenoptik-Votan dicing tool

o    Market Data - Assumptions

o    Laser vs saw

o    Market Revenue for HB/UHB LEDs

o    Market of equipment in number of units

o    Market revenue of equipments in $M

·         DIE BONDING

o    Location of the process

o    Choosing die attach material

o    New material for HB/UHB LED - AuSn

o    AuSn – Strength and weakness of deposition methods

o    Summary

o    Market Volume for Die Attach Material

o    Market Revenue for Die Attach Material

o    Market in number of die bonding equipment

o    Die bonding equipment – market in $M

·         INTERCONNECT

o    Location of the process

o    What’s new?

o    Evolution in wirebonding

o    Matrix LED – features

o    Flip Chip Technology

o    Wirebond VS Flip Chip

o    Flip-chip coupled with back-face contact reflector

o    Stud Bumping

o    Example of Lumileds Luxeon K2

o    Laser Lift-Off (LLO) & Flip-Chip

o    Laser Lift Off Technique: definition

o    Laser Lift Off Technique: OSRAM

o    LLO equipment

o    LLO technique & Flip-chip mounting

·         TEMPORARY BONDING

o    introduction

o    Thin-wafer handling: different solutions

o     principle

o     Main methods: a comparison

o    wax

o    adhesive tapes

o    EVG temporary bonding tools

·         THERMAL MANAGEMENT

o    Location of the process

o    Thermal Solutions

o    Thermal solutions - Managing the LED Thermal System Configuration

o    Substrates

o    Substrates - SMD organic

o    Substrates - Metal Core Printed Circuit Board

o    Substrates - FR4 Board & Flexible Substrate

o    Substrates - Ceramic Substrates

o    Substrates - Direct Bonded Copper

o     Substrates – Trends for DBC

o    Substrates - Summary

o    Substrates – Trends : Chip On Board

o    Substrates – Main Players

o    Substrates – Market Data

o    Substrates – Market Volumes

o    Substrates – Market Revenue

o    HB LED submount – Market Breakdown

o    HB LED submount – Supply Chain

o    Thermal Interface Material

o    Thermal Interface Material – Main Players

o    Heatsink

o    Heatsink – Main Players

o    Summary – LED Package with optimized heat transfer

·         ENCAPSULATION, LENS & PHOSPHOR

o    Location of the process

o    Optical extraction techniques

o    Remote phosphor

o    Silicon Product - Shin Etsu

·         WAFER LEVEL PACKAGING

o    Main challenges for Power LED WLSP

o    Market drivers – Power LED Packaging

o    Power LED Packaging Manufacturer Motivations & Segmentation

o    3D-TSV developments for Power LEDs

o    Overview of power LED packaging types

o    Drivers for LED silicon packaging solutions

o    Supply chain focus on ESD protection using Si submounts for HB LEDs

o    Hymite: Silicon HB-LED packages

o    Silicon interposer for MEMS / LED Applications

o    3-D interposer to combine MOSFET + ASIC LED driver

o    WLP : VisEra technologies

o    Estimation of 6” Silicon wafer demand for LED submount and WLP

o    Conclusion & challenges