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LED market analysis report with detailed descriptions of process, equipment and materials for LED assembly.
OBJECTIVES
OF THE
REPORT
The
market is
a
high-growth
field in
the
semiconductor
industry.
The supply
chain is
filled
with
various
players
from LED
die
manufacturers
(Epistar,
Forepi,...),
to LED
assembly
suppliers
(Harvatek,
Citizen,
Liteon,
Samsung,...)
to fully
integrated
players
(Lumileds,
Osram,
Toyoda
Gosei...)
In
the wide
range of
LED
packaging
solutions,
this
report
describes
the
existing
packaging
process
flow,
materials
and
equipment
and the
main
evolution
in the
coming
years.
LED
devices
have been
split in 2
categories:
The
main
processes
are
presented
for both
groups:
-
Dicing
-
Die
bonding
-
Electrical
interconnect
-
Thermal
management
-
Encapsulation
The
report
highlights
the main
technical
challenges,
current
solutions
and future
trends.
This
report
also
includes
market
analysis
on
equipment,
materials
and
services.
MAIN
CHALLENGES
For
the 2
types of
LED,
assembly
approach
is not the
same.
-
Regular
LED
packaging
process
flow
is
based
on
standard
IC
process
and
almost
the
same
standard
material.
The
main
reason
is
cost
because
regular
LED
are
low
cost
products
(<
$0.10)
-
As
a
future
lighting
source,
HB/UHB
LED
packaging
should
have
good
optical
properties,
high
thermal
dissipation
and
high
reliability.
The
better
product
is a
right
combination
between
optical,
thermal
and
reliability.
It
is
possible
today to
make that
perfect
product,
but the
cost would
be so high
that it
will not
be
successful.
A choice
has to be
made for
each
application:
for
example,
optical
efficiency
for LCD
backlighting
and
thermal
management
for
automotive
lighting.
Today
LED
packaging
has a law:
ONE
PROCESS,
ONE
PRODUCT,
ONE
APPLICATION
Unlike
regular
LED, no
standards
currently
exist for
packaging
of HB-LED.
Each LED
vendor has
their own
proprietary
design for
most
aspects of
the
assembly
process
flow.
Cost
is the
primary
driver and
cheaper
solutions
with the
best
optical or
thermal
properties
are under
investigation.
Main goals
are the
reduction
of the
number
parts, use
of less
expensive
material,...
A
major
issue
today is
that the
LED
manufacturing
process is
made on 2
or 3
inches
wafers
that
create
handling
issues on
equipment.
We believe
that the
move to 4
then 6 or
8 inch
wafers
will allow
more
standardized
solutions
using
regular
processes
and
equipment.
In
particular
there is a
big trend
for Wafer
Level
Packaging
of silicon
LED
modules
which aims
at pushing
LED to the
general
lighting
market.
KEY
FEATURES
OF THE
REPORT
-
Detailed
process
flow
of LED
packaging
(dicing
step,
electrical
interconnect,
substrates,..)
-
Market
trends
and
figures
for
linked
material
and
equipment
(in
million
$, in
number
of
units,
ASP,..)
-
Key
drivers
for
each
technology
&
material
in use
-
Supply
chain
analysis:
who is
doing
what?
COMPANY
INDEX
3M,
ACC
silicones,
Accretech,
ADT, AiT,
Allvia,
ALSI,
ALSI,
Applied
NanoWorks,
ASMPT,
Asymtek,
Avago,
Bergquist,
Bosch,
CeramTec,
ChipMOS,
C-Mac,
CMD,
Cofan,
PCB,
Cookson,
CREE, CTS,
Daltec,
Datacon,
Disco,
Doosan,
Dow
Corning,
Dupont,
Dynatex,
Electrovac
curamik,
Epcos,
Epoxy
Technology,
EVG,
Evident
Technologies,
Friatec,
GE,
Hamamatsu,
Heatron,
Heraeus,
Hesse
&
Knipps,
Hymite,
Hysol,
Indium
Corp.,
Intematix,
ipdia,
Jenoptik,
JPSA, KNS,
Kulicke
&
Soffa,
Kyocera,
LG
Innotek,
Lintec,
Lord, Lumi
Tech,
Lumileds,
Master
Bond,
Micron,
Murata,
Natel, New
Wave
Research,
Nitto-Denko,
NTK,
Nusil,
Oerlikon,
Optek,
Osram,
Oxford
lasers,
Palomar
Technology,
Panasonic,
PhosphorTech,
Rexpan,
Semitool,
Shin Etsu,
Shinko,
SMM,
Spectrum
Plastics,
STM, SUSS
MicroTec,
Synova,
TDK, TEL,
Thermagon,
Ticona,
TMT, Tong
Hsing,
Toshiba,
Toyoda
Gosei,
Tridonic,
Trumpf,
TSMC,
Veeco,
VisEra,
Xsil,
Zevac.
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