Who should buy this reports?

• Integrated semiconductor Device Manufacturers and fabless semiconductor companies

  • Benchmark the status of 3D integration within the industry

  • Identify possible partnership for your forthcoming developments and find a second source packaging subcontractors for your 3D TSV components
    

• Assembly and Test Service companies

  • Get the list of the main 3D IC players and users

  • Screen possible new 3D integration applications to support diversification strategy
    

• Equipment and Material suppliers

  • Understand the differentiated value of your products and technologies in this market

  • Identify new business opportunities and prospects  
    

• Electronic module makers and Original Equipment Makers

  • Evaluate the availability and benefits of using 3D components in your end system

  • Monitor different 3D component suppliers to adjust your sourcing strategy  
    

• PCB / IC substrate manufacturers

  • Monitor the evolution of IC Packaging & Assembly, especially linked to the emerging 3D TSV interposers, IPD and chip embedding PCB-based technologies
    

• IC and MEMS Foundries

  • Spot new opportunities & define diversification strategies by reusing your infrastructure and expertise within the 3D Packaging market

Key features of the reports

• Updated market forecasts & technology roadmaps for 3D IC components:

  • Impact of the economic downturn on the 3D TSV market

  • Market forecast update for MEMS, CMOS image sensors, logic, analog and memory applications

  • New application areas covered: HB-LED modules, power and solar components

  • Business case for 3D interposers: applications, market and players  
    

• 3D IC players 2008 market shares & revenues breakdown in $M (as packaging services or estimated in relative packaging value)  
  

• Supply chain perspectives, key players and emerging infrastructure for 3D Packaging  
  

• Strategic technology choices for 3D integration scenarios:

  • Analysis of the different possibility for the implementation of TSVs and the rationale behind (via first / via middle / via last / via after bonding)

  • Analysis of the cost structure for different implementation cases (vias in front-end, vias at packaging assembly house, C2W versus W2W, ?)