2.5D, 3DIC and TSV Interconnect Patent Investigation report (Ed. May 2013)A Patent Investigation is a new type of report providing a clear link between IP situation and market evolutions.
More than describing the status of the IP situation, a Patent Investigation provides a missing link between patented technological solutions and market, technological and business trends.
It includes key technical insight into future technology trends and challenges.
By combining their technical knowledge, business understanding and patent search, Yole Développement and KnowMade are able to provide unique analysis and added-value in the report.
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