EVENTS


Yole Développement attends more than 80 events this year.

To get more information on an event or to meet with our analysts, please contact Sandrine Leroy (
leroy@yole.fr).

Please find here 2014 events selected by Yole Développement.

See below our July - December 2014 selection:


SEMICON West
July 8 to 10, 2014
San Francisco, CA, USA

From cutting-edge equipment, processes, and materials, to solutions to today's design and manufacturing challenges, SEMICON West connects you to the people, products, and technologies advancing the future of microelectronics!

http://www.semiconwest.org/






IWN

August 24 to 29, 2014
Wroclaw, Poland


The International Workshop on Nitride Semiconductors (IWN2014) will be held in Wrocław, Poland. This workshop follows the first workshop held in Nagoya, Japan (IWN2000); the second in Aachen, Germany (IWN2002); the third in Pittsburgh,USA (IWN2004); the fourth in Kyoto, Japan (IWN2006); the fifth in Montreux, Switzerland (IWN2008); the sixth in Tampa, USA (IWN2010) and seventh in Sapporo, Japan (IWN2012). The workshop consists of three parts: the general meeting, topical workshops, and the summary meeting.

http://iwn2014.pl/?ja-event=the-international-workshop-on-nitride-semiconductors






Advanced Packaging & Integration Technology Symposium

August 28, 2014
Wuxi, China

Yole Développement (Yole) and National Center for Advanced Packaging (NCAP China) collaborate to develop a powerful program and attract the leaders of the advanced packaging industry. Both partners, strongly involved in this area, propose a dedicated event, Advanced Packaging & Integration Technology Symposium, focused on:
• 3D integration technologies and market trends
• Interposers activities, technology roadmaps and key players
• MEMS packaging
• Manufacturing readiness

http://www.i-micronews.com/news/NCAP-Yole-symposium-final-agenda-includes-key-players!%2C12150.html

 






SEMICON Taiwan 
September 3 to 5, 2014
Taipei, Taiwan

SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics. Experience everything that SEMICON Taiwan has to offer - Don't miss it!!

http://www.semicontaiwan.org/en/






EPE 2015 
September 8 to 10, 2014
Geneva, Switzerland

The EPE Conference Committee invites you to come to EPE'15-ECCE Europe, the 17th European Conference on Power Electronics and Applications (and Exhibition), to be held in Geneva, Switzerland. The conference follows previous successful conferences held in major university cities across Europe since 1985: Brussels, Grenoble, Aachen, Florence, Brighton, Seville, Trondheim, Lausanne, Graz, Toulouse, Dresden, Aalborg, Barcelona, Birmingham and Lille.

http://event-epe2015.web.cern.ch/event-epe2015/






Inertial Sensors & Systems  
September 16 to 17, 2014
Karlsruhe, Germany

With respect to the expanded focus and the scientific topics covered at the symposium during the last years the conference name has changed from "Symposium Gyro Technology" to "Inertial Sensors and Systems". Besides this adaption the conference will stay in the tradition of the last years and keep its high profile in latest inertial technology.You are kindly invited to attend the symposium on Inertial Sensors and Systems, which will be held in Karlsruhe, Germany at 16 and 17 September 2014.

http://iss.ite.kit.edu/






Electronics System-Integration Technology (ESTC) Conference and Exhibition
September 16 to 18, 2014
Helsinki, Finland

The 5th Electronics System-Integration Technology (ESTC) Conference and Exhibition is a premier international event, organized by IEEE-CPMT and IMAPS-Europe, in the field of smart system integration and microelectronics packaging.

http://www.estc2014.eu






Lab-on-chip World Congress  
September 18 to 19, 2014
San Diego, CA, USA

Bringing together researchers and industry participants from both academia and industry, this conference will discuss the innovative developments in Lab-on-a-Chip (LOAC), Microfluidics, and Microarrays Spaces. Presentations will explore the latest advances in LOAC, Microfluidics and Microarrays. Focus at this conference will also be given to some of the many applications of Lab-on-a-Chip, from life science research, to taking diagnostics to the point-of-care/point-of-need.

http://selectbiosciences.com/conferences/index.aspx?conf=LOACWC2014






ECSCRM  
September 21 to 25, 2014
Grenoble, France

The aim of the conference is to discuss recent advances in theoretical and experimental investigations of crystal growth, characterization and control of material properties, as well as other basic research issues concerning wide bandgap semiconductors such as silicon carbide (SiC), III-nitrides, diamond and their related materials such as graphene.

http://ecscrm2014.org/






SEMI MEMS Tech Seminar  
September 23, 2014
Milan Italy

Hosted by Politecnico di Milano SEMI Europe Grenoble Office invites you to attend its 3rd MEMS Tech Seminar on Sept 23rd, 2014 in Milan. This event, hosted by Politecnico di Milano, will focus on "The Future of MEMS: 2020 and Beyond". The MEMS Tech Seminar will feature experienced invited speakers from major organizations from the industry. Many networking opportunities will be proposed, including 2 Speed-Networking sessions (5 min per SEMI member company). Finally, prior the event, a Networking Dinner - not to be missed - will be proposed on Sept 22nd. This Tech Seminar is a SEMI Europe initiative to support European companies, start-ups and laboratories involved in the growing MEMS market

http://www.semi.org/eu/node/8791






LpS (LED professional Symposium)   
October 1 to 2, 2014
Bregenz, Austria

It isn’t only the general lighting market that is being fundamentally changed by Solid State Lighting technologies; it’s the whole lighting industry. Predictions for the next five to seven years are that we’ll see more LED/OLED performance increases along with continuous price declines. The challenges of phasing out old technologies and ramping up new technologies are huge. Therefore, profitability is key to survival in this volatile environment.

http://www.led-professional-symposium.com/






European MicroWave Week    
October 5 to 10, 2014
Roma, Italy

The event focuses on the needs of engineers and researchers and offers an opportunity for both communities to discuss the latest trends and developments in the field of application of microwaves. Microwave devices, systems for telecommunications (both terrestrial and space-borne), transportation, medical, radar and new areas of application will be included in the programme. Particular emphasis will be placed on space-related technologies and applications.

http://www.eumweek.com/






SEMICON Europa    
October 7 to 9, 2014
Grenoble, France

Based on the intention to significantly increase the global semiconductor manufacturing share by public/private investment plans throughout Europe, SEMI has decided to rotate SEMICON Europe between the two largest semiconductor R&D and manufacturing clusters in Europe, namely Dresden and Grenoble. Consequently, SEMICON Europa 2014 will be held on October, 7-9 in Grenoble and return to Dresden in 2015. We are confident this rotation concept will provide increased business opportunities for our exhibitors and visitors. Additionally, we believe this strategy strongly supports the recently announced European Union’s EU10/100/20 initiative.

http://www.semiconeuropa.org/






MEMS Executive Congress US     
November 5 to 7, 2014
Scottsdale, AZ, USA 

The 10th annual MEMS Executive Congress is the only place for technology executives to:
- Find MEMS and sensor-based solutions to customer needs
- Discover how MEMS and sensors can drive competitive advantage
- Learn about new consumer-driven, market-based opportunities for MEMS and sensor solutions
- Network with other, high quality MEMS and sensors executives

http://memsindustrygroup.site-ym.com/events/event_details.asp?id=442221&group=






Global Interposer Technology 2014 Workshop (GIT 2014)     
November 5 to 7, 2014
Atlanta, GA, USA 

The GIT 2014 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.

http://www.prc.gatech.edu/MediaCenter/Links/Announcing%20GIT%202014.pdf






Be flexible      
November 19 to 20, 2014
Munich, Germany 

This international platform with two consecutive days is intended for scientists, applied researchers, equipment suppliers and users. An excellent opportunity to exchange ideas and experiences in the world ofthin semiconductor devices and flexible electronics. The workshop day thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers, dicing concepts and self-assembly concepts as well as the integration in flexible electronic systems for a multitude of applications.

http://www.be-flexible.de/index.html






MRS     
November - December 30 to 5, 2014
Boston, MA, USA 

Founded in 1973, MRS now consists of over 16,000 members from the United States — as well as nearly 70 other countries. The interdisciplinary materials science society is different from that of single discipline professional societies because it encourages communication and technical information exchange across the various fields of science affecting materials.

http://www.mrs.org/fall2014/






SEMICON Japan      
December 3 to 5, 2014
Tokyo, Japan

SEMICON Japan will move to a new venue this year! "Tokyo Big Sight" is ideally located in the Tokyo Metropolitan area both for visitors and exhibitors. At this new location, SEMICON Japan will address INNOVATIONs, through both exhibition and sessions, including:
- Next Generation Lithography
- New Transistor Architectures
- 2.5D and 3D ICs
- Nanoinprinting
- < 10 nm Processes ...
SEMICON Japan 2014 will also address mobile technologies and new and emerging markets driven by the explosion of interest in the Internet of Things.

http://www.semiconjapan.org/en/






3-D Architectures for semiconductor Integration and Packaging      
December 10 to 12, 2014
Burlingame, CA, USA 

SEMICON Japan will move to a new venue this year! "Tokyo Big Sight" is ideally located in the Tokyo Metropolitan area both for visitors and exhibitors. At this new location, SEMICON Japan will address INNOVATIONs, through both exhibition and sessions, including:
- Next Generation Lithography
- New Transistor Architectures
- 2.5D and 3D ICs
- Nanoinprinting
- < 10 nm Processes ...
SEMICON Japan 2014 will also address mobile technologies and new and emerging markets driven by the explosion of interest in the Internet of Things.

http://techventure.rti.org/