EVENTS


Yole Développement attends more than 80 events this year.

To get more information on an event or to meet with our analysts, please contact Sandrine Leroy (
leroy@yole.fr).

Please find here 2014 events selected by Yole Développement.

See below the March 2014 to June 2014 selection:


IMAPS
March 9 to 13, 2014
Scottsdale/Fountain Hills, Arizona USA

The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, on March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

http://www.imaps.org/devicepackaging/






Lab-on-a-Chip European Congress
March 10 to 11, 2014
Berlin, Germany

The 6th Lab-on-a-Chip European Congress will bring together leaders from both academia and industry to discuss innovative developments in this exciting field. Attention will also be given to some of the many applications of Labs-on-Chips, from the enhancement of life science research, to taking diagnostics to the point of need. Overall this track will provide an excellent snapshot of this rapidly growing field.

http://selectbiosciences.com/conferences/index.aspx?conf=LOACEC2014






MEMS Executive Congress® Europe 2014
March 11 2014
Munich, Germany


MEMS Industry Group is making some exciting changes to MEMS Executive Congress EU 2014 to make it even more of a “Can’t-Miss” event.  It will feature speakers, keynotes, and panels covering the topics of: MEMS in automotive, consumer products, healthcare, energy and industrial. Additionally, the Congress will begin with a networking dessert reception on the evening of March 10, continuing the tradition of providing what our attendees love the most... opportunities to network with each other!

https://www.etouches.com/ehome/index.php?eventid=73040&







Global Semiconductor Forum
March 12 to 14, 2014
Singapore

GSF is an executive level event focusing on manufacturing and innovation, providing the platform for executives from around the world, from within IDM’s, foundries, fables and LED companies to come together and ensure the pace of developments continues on time and on budget.

 http://www.arena-international.com/gsf/








APEC 2014
March 16 to 20, 2014
Fort Worth, TX, USA

As The Premier Event in Applied Power Electronics™, APEC focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference, APEC has something of interest for anyone involved in power electronics.

http://www.apec-conf.org/








CS International Europe
March 18 to 19, 2014
Frankfurt, Germany
 
To gain a comprehensive overview about the entire compound semiconductor industry, the must attend event for 2014 is the 4th CS International conference in Frankfurt, Germany.

http://www.cs-international.net/







Image Sensors
March 18 to 20, 2014
London, UK

COMPAMED holds in parallel with MEDICA. COMPAMED is the international trade fair for suppliers to medical device manufacturers. This event welcomed 645 exhibitors and over 16,000 visitors from 34 nations in 2012. This year, suppliers are increasingly focused on ergonomics. Ultrasonic equipment, workstations or patient monitors – despite continuous performance improvements in medical devices their handling is getting constantly easier. This is made possible by modern touch-screen GUIs and intuitive menus as customized by selected COMPAMED exhibitors for medical technologies providers. For more information, please go to COMPAMED website.,

http://www.image-sensors.com/home.aspx



MEMS sensor Seminar, Sensor roadmap: The pathway to the next ‘BigThing’
March 20, 2014
Munich, Germany

Yole Développement and Fraunhofer EMFT organize a MEMS Seminar dedicated to the sensors roadmap in Munich onMarch 20th, 2014. The seminar includes presentations on innovations and requirements for sensors on the road to become the next ‘BigThing’. Yole Développement shall detail the technology roadmap and give a market outlook. The Panel discussion addresses the key question: Are we ready for the next Sensor Growth?

http://www.i-micronews.com/news/Sensor-roadmap-pathway-%E2%80%98BigThing%E2%80%99,11372.html







3D Integration Technology
March 24 to 28, 2014
Dresden, Germany

You are invited to present your latest results in wafer bonding technologies and their application in microsystems technologies, to learn about how to use wafer bonding in complex technologies, get news about wafer bonding equipment as well as about testing of wafer bonded interfaces and finally meet your colleagues working in this field for fruitful discussion.

http://www.date-conference.com/







Phosphor Global Summit 2014
March 26 to 28, 2014
San Diego, CA, USA


Phosphor Global Summit 2014 has the most up-to-date news and developments in the field of phosphors - highlighting important topics like OLED and LED lighting perspectives, ceramic phosphors for high luminance applications and much more!

https://www.smithersapex.com/phosphor-global-summit-2014.aspx







2014 Biosensors & Analytics Conference
April 23 to 24, 2014
Cleveland, OH, USA

In the coming years biomedical research will accelerate at a rate far exceeding the rates of the past few decades. People will start to be individually distinguished with great accuracy through personal requirements as it relates to medications, devices, the environment in which they live, and other factors.

http://www.bioohio.com/event/2014-biosensors-analytics-conference/






SEMICON Singapore
April 23 to 25, 2014
Singapore, Singapore

As the only microelectronics trade and technology event in Southeast Asia, SEMICON Singapore is at the center of the region’s vibrant and growing. In 2014, SEMICON Singapore is expanding its scope and programs to the industry bringing more buyers from across the region, including programs and initiatives to attract buyers from Malaysia, Thailand, the Philippines, Vietnam, and Indonesia.

http://www.semiconsingapore.org/






nanomicro biz - ROBOTECH
April 23 to 25, 2014
Yokohama, Japan

The world’s Largest Exhibition Focusing on Micro/MEMS and Nanotechnologies.Exhibition on Next-Generation Service Robot Manufacturing Technologies. Nano Micro Biz and ROBOTECH are the integrated business platform combining showcase of latest exhibits and business seminars on newfangled technologies on Micro/Nano and Service-Robot Manufacturing Technologies.

http://www.micromachine.jp/en/






MIG Japan
April 24, 2014
Tokyo, Japan

The MEF will hold its sixth forum on Friday, the 25th of April in Tokyo, Japan, where MIG Executive Director, Karen Lightman, will also be presenting. View the rest of the 2014 program schedule. The MEF is intended to encourage any engineer keen on participating in MEMS activities to attend, focusing discussions on all MEMS topics, including: information, ideas, strategy, collaboration, investment, etc.

https://www.etouches.com/ehome/73231/145657/?&






MEMS Engineer Forum 2014
April 25, 2014
Tokyo, Japan

This forum is a unique opportunity operated mainly among engineers close to the MEMS technology, which is the vital key for the 21st century. We strongly believe the key players in this field will drive the world in various business scenes over the next 10 years. Since the start of the 1st MEF in March 2009, this forum has been held annually with MEMS researchers, developers, engineers gathering in one place.

http://www.mef2014.info/






SPIE - Defense,Security & Sensing
May 5 to 9, 2014
Baltimore, MD, USA

SPIE DSS 2014 hosts the industry's most important scientific conferences and exhibition on optics, IR imaging, lasers, and sensing for defense, security, industry, healthcare, and the environment.

http://spie.org/x6765.xml






Symposium on Polymers for Microelectronics
May 6 to 8, 2014
Wilmington, DE, USA

The Symposium has become one of the most comprehensive meetings held on the implementation and the processing of polyimides and new polymeric materials in advanced semiconductor, electronic packaging and assembly applications. Many more topic categories are being added this year, such as emerging applications such as Medical applications, sensors, photovoltaics, etc. This meeting offers you a unique opportunity to feature your instruments, materials, systems, publications and software to a focused, international marketplace.

http://www.symposiumonpolymers.com/exhibitingopport.html






Electrochemical Society
May 11 to 15, 2014
Orlando, FL, USA

Meet and introduce your organization to thousands of scientific leaders this spring when they gather together in Orlando for the 225th ECS Meeting. Sponsorship and exhibit opportunities offer major benefits and provide an extraordinary chance for businesses to present their products and services to key constituents from around the world.

http://www.electrochem.org/meetings/biannual/225/






BIOTech
May 14 to 16, 2014
Tokyo, Japan 

Gathering 600* exhibitors, 200* presentations and 15,000* visitors, BIOtech Japan is Asia's LARGEST industry gathering. Be a part of this big event, where new business opportunities, technological innovations and industry-academia collaborations are born!

http://www.bio-t.jp/en/






ASMC
May 19 to 21, 2014
Saratoga Springs, NY, USA

Celebrating 25 years of manufacturing excellence, the SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry.  The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  The 2014 conference is co-chaired by Israel Ne'eman, Applied Materials and Oliver Patterson, IBM Microelectronics.

http://www.semi.org/node/46111






CS Mantech
May 19 to 22, 2014
Denver, CO, USA

It is ONLY at CS MANTECH where you can find an international body of industry experts, sharing business and technical knowledge. In 2014, we bring our community for the first time to the Mile-high City Denver, Colorado, USA! It is my pleasure to invite you to be part of this elite group at the Sheraton Denver Downtown Hotel between May 19 and May 22, 2014. This gathering in 2014 marks the 29th year of this very important international gathering.

http://www.csmantech.org/






SNEC PV POWER EXPO 2014
May 20 to 22, 2014
Shanghai, China

Hosted by the Asian Photovoltaic Industry Association (APVIA), the Solar Leaders Dialogue invites high-level representatives from industry associations in Europe, Asia and North America, CEOs from leading PV companies, industrial experts and scholars, participants from market research institutes, financial institutions and media, as well as the public to discuss extensively on the sustainable development of the solar industry.

http://www.snec.org.cn/default.aspx?lang=en






PCIM Europe
May 20 to 22, 2014
Nuremberg, Germany

From 20 – 22 May 2014, the industry's key international players will meet in Nuremberg. Get up-to-the-minute information on the newest trends and developments as well as state of the art solutions for your most challenging problems. 

http://www.mesago.de/en/PCIM/home.htm






Power electronics market and technology briefing on power packaging
May 20 to 22, 2014
Nuremberg, Germany

How new device technologies will drive power packaging? A push for improvement and a market evolution market briefing will provide market metrics and forecasted trends for power packaging, and evaluate their impact on the power electronics industry.
Yole Développement's Power Electronics team will present the findings from its recent power packaging analysis. This will be followed by a presentation of power module main players. Afterwards, all attendees are welcome to participate in a panel discussion, during which we'll compare and contrast different points-of-view and visions. 

veyrier@yole.fr






12th Annual MEMS Technology Symposium
May 22, 2014
San José, CA, USA

Technical innovations in design, process, materials, packaging and test have enabled widespread commercialization of breakthrough MEMS products. MEMS sensing applications will track growth in mobile, industrial, consumer and biomedical markets, enabled by innovations in functional sophistication, cost-reduction, and productivity.  

http://www.meptec.org/meptec2014memste.html






ISiCPEAW
May 25 to 27, 2014
Kista, Sweden

ISiCPEAW 2014 is a three-day event, consisting of one tutorial day + two workshop days, covering the latest results and innovations in power electronics applications of silicon carbide technology. From May 25 to 27, international experts will meet in Stockholm to share their expertise, recent developments and visions of SiC electronics applications. More than an overview on SiC industry, ISiCPEAW proposes a focus on power electronics applications. The event also includes an exhibition area, a poster session and networking opportunities with business-to-business (B2B) matchmaking.

http://www.b2match.eu/isicpeaw2014






ECTC
May 27 to 30, 2014
Lake Buena Vista, FL, USA

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2014 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.

https://www.ectc.net/