Power module packaging: latest innovations are driven by EV/HEV and WBG technologies

Extracted from: Power Module Packaging report, Yole Développement, July 2018 - Automotive Power Module Packaging Comparison report, System Plus Consulting, July 2018


  • Power packaging is continuously adapting to power application market trends.
  • The IGBT power module market grew 18.1% in 2017, driving the power module packaging materials business.
  • Silver sintering, new substrates and interconnection technologies are the latest innovations driven by EV/HEV and the arrival of WBG.
  • A WBG packaging chapter, Tesla’s Model 3 power modules and Mitsubishi Electric’s J1 series innovative integrated substrates.

LYON, France – Sep. 6, 2018:  Technical innovations in power module packaging are mainly driven by the challenging system requirements of the booming EV/HEV industry and the entrance of WBG materials.
The companies Yole Développement (Yole) and System Plus consulting, both part of Yole Group of Companies propose today, two dedicated analyses to get a better understanding of the market evolution and technical issues of the power module packaging industry: Power Module Packaging Report, 2018 edition and Automotive Power Module Packaging Comparison 2018 report.
Once again, both partners combine their expertise to provide a deep added-value study. Taking into account the whole value chain, the market issues and technical expectations, analysts propose you today a valuable vision of the tomorrow’s industry.

 The introduction of the WBG semiconductors, SiC and GaN is today pushing the development of new power packaging solutions, announces the market research and strategy consulting company, Yole. SiC technologies become step by step an essential solution to answer the industrial requirements, with a market estimation reaching 29% CAGR between 2017 and 2023 . Actually, WBG devices can work at higher switching frequencies and higher junction temperatures.
The latest Model3 inverter from Tesla is a good example of WBG penetration, showing the added-value of STMicroelectronics’ SiC power module, reverse engineered by System Plus Consulting (More info.).

Beyond the semiconductor industry, the EV/HEV industry’s demand for high power density and mechatronics integration is also driving many power electronics innovations with dedicated packaging solutions. New standards in terms of electrical devices and systems become a reality, pushing electronic components to work in non-conventional environments for longer. System Plus Consulting’s report, Automotive Power Module Packaging Comparison 2018 report details the physical composition and cost of ten modules for automotive applications from five different manufacturers. Analysts reviewed the different topologies and techniques used for the module packaging. Under this new report, System Plus Consulting’s analysts highlight the specificities of each solution, defined by the car makers.
“There is not yet a standardized package in automotive application” comments Farid Hamrani, Cost Engineer at System Plus Consulting.

Under a continuous process of innovations, the power module packaging industry is in a good shape. This market is showing a 8.2% CAGR during the period 2017-2023, reaching a global sector of almost US$ 2 billion at the end of the period.
With two major technical trends, over-molded double-side cooled modules for hybrid cars and single-side cooled modules with pin-fin baseplates for full electric cars, this industry is dominated by IGBT power modules:
“The IGBT power module market grew 18.1% in 2017”, announces Dr. Milan Rosina, Senior Technology & Market Analyst, Power Electronics & Batteries at Yole. “No doubt today, that IGBT modules are driving the power module packaging materials business.”
Indeed 2017 was an impressive year for the IGBT power module market. And 2018 perspectives are even better, with over 20% growth in the first half of the year. The main explanation of this drastic market explosion is the boost from the EV/HEV sector, especially in China. It has also been an exceptional year for industrial motor drives in Asia. In parallel, other device modules, like those based on MOSFETs and bipolar transistors, show a slight decrease.
Consequently the overall power module market is expected to be over US$5.5 billion in 2023. This promising market is directly beneficial for the packaging material business.

The power module packaging material business is worth US$1.2 billion, a little more than a third of the total power module market. “It is a very dynamic market, where continuous innovations and material enhancements and a lot of R&D investment are needed”, comments Alejandra Fuentes Suarez, Technology & Market Analyst at Yole.
This power module packaging material market’s CAGR for 2017-2023 will be 8.2%, coming close to a US$2 billion business opportunity by 2023…

Power module packaging report from Yole highlights the market trends and forecasts and provides a comprehensive analysis of the package designs and materials. In addition, it describes the current packaging challenges, especially for SiC and GaN technologies. Key technology trends are also well detailed in this report, showing the impact of the market evolution.
Yole Group of Companies including Yole Développement and System Plus Consulting proposes a detailed description of its reports on the following websites: i-micronews.com and www.systemplus.fr.

In addition to a dedicated power electronics webcast powered by Yole and welcoming invited industrial speakers (More info.), Yole Group of Companies looks forward seeing you at Semicon Europa and Electronica in November, in Munich, Germany.
Yole will present two key power electronics & compound semiconductor presentations: 
   •  "How battery pack evolutions create opportunities for power electronics companies" on Nov. 15 at 12:20 PM during the Battery Session.
   •  "GaN power HEMT reliability research within the POWERBASE" taking place the same day at 2:00 PM during the Power Electronics Session.
Feel free to visit System Plus Consulting and Yole at booth # A4667.
Stay tuned!

(1) source: Power SiC 2018: Materials, Devices and Applications report, Yole Développement, July 2018

EV/HEV : Electric/Hybrid Electric Vehicle
WBG : Wide Band Gap
SiC : Silicon Carbide
GaN : Gallium Nitride
CAGR : Compound Annual Growth Rate

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