FCBGA packaging reaches new heights to US$12 billion by 2025


  • Market forecasts:
    FCBGA package revenue is expected to reach US$12 billion US USD by 2025 from $10 billion in 2020, driven by AI , datacenter and HPC momentum.
    FCBGA packages are expected to reach 3% CAGR4 over the next five years (in revenue).
    FCBGA revenue is expected to surpass US$10 billion by 2025. The majority of wafer demand stemming comes from 3D stacked devices with total wafer growth CAGR at 8.5% compare to 2020.
    It includes FCBGA, Fan-out, WLCSP , and 3D stacked packages.
    The 3D stacked IC targets for 24.8% CAGR over the next five years with HBM accounting for 48% growth, 3D accounting for 27% and 3D NAND for 82%.
  • Supply chain:
    TSMC remains the leader with 69% market share in 2019 for fan out packages.
    WLCSP packages get a strong foothold in smart phone eco-system.
    ASE, JCET, Amkor, and SPIL lead the WLCSP wafer market.


FCBGA package revenue is expected to reach US$12 billion US USD by 2025 from $10 billion in 2020. This unprecedented growth is due to increased demand in automotive, high performance computing, laptops and client computing segment and increased need for graphics in consumer and server applications.
According to Vaibhav Trivedi, Senior Technology & Market analyst, Semiconductor & Software division at Yole Développement (Yole):
“FCBGA packages traditionally been used in workstation, laptop, and desktop applications as CPU s and server CPUs. These markets have traditionally been dominated by giants such as Intel and AMD. With slow-down of Moore’s law in recent years, how to assemble, package and integrate various functionality blocks in the SoC has become increasingly challenging. High Density FCBGA substrate continues to evolve and get more denser with finer line & space as more routing and multiple chips are being heterogeneously integrated on to the substrate”.
FCBGA packaging can be broken down in key ingredients such as wafer bumping using CuP , packaging that includes die singulation, chip attach, underfill, and mounting a thermal solution as many SoCs have high TDP requiring integrated heat spreader and thermal interface material.

For more information, discover Vaibhav Trivedi’s article: Rise of FCBGA packages amid coronavirus pandemic on i-Micronews.


WLCSP/Fan-In packages have found its place in many smartphone devices due to its lowest cost and scalability features. WLCSP can be found in PMICs, PMU s, Audio Codecs, RF transceivers, switches, antenna tuners, CMOS Image Sensors and number of other applications suited for consumer market such as for smartphone and wearable device application. WLCSP remains an attractive option given its reasonable reliability, process maturity, and lowest cost. OSATs remain top leaders in manufacturing WLCSP as it has become a commodity market.
Yole’s analysts follow closely the advanced packaging industry. In this regard, they release the OSAT ranking every year.
In 2020, Vaibhav Trivedi and Favier Shoo, Technology and Market Analyst, Package, Analyst & Substrate at Yole wrote “the Future of OSATS” article for Chip Scale Review. Discover it on i-Micronews.

FO packaging began several years ago with limited applications, but it has now found a critical role and rightful place in the high-end packaging sector as a mature, reliable package technology. In fact, TSMC’s InFO form-factors brought FO technology to new heights in 2015 as Apple launched its A10 with InFO-PoP approach.
According to Favier Shoo from Yole:
“FO packages are primarily used in the mobile and consumer segments, with some proliferation in automotive radar. FO packaging is expected to gain wider adoption as 5G, AI, and autonomous driving take flight in the coming years - and revenue stemming from FO packaging is expected to reach US$2 billion - US$2.5 billion by 2025”.
Fan-Out panel packaging efforts are mainly being championed by PTI and Samsung electronics and this monitor also sheds light on panel level production using Fan-Out packaging technologies.

Yole’s Advanced Packaging Monitor has been published every beginning of March (Q1), June (Q2), September (Q3) and December (Q4)... Aim of these services is to provide an in-depth coverage of rapidly changing market dynamics and main players’ status and strategy.. This monitor subscription provides quarterly updates on unit shipments, wafer production, and revenue on near-term and long-term basis. It provides capacity, CapEx, and supply chain insights into emerging markets and growth rates in mature markets in addition to providing package level forecast: • Module I: Fan-Out Package Monitor – Wafer & Panel level (2019 Q4 released)
• Module II: WLCSP / Fan-In Package Monitor (2020 Q1 released)
• Module III: 2.5D/3D Stacked Package (2020 Q3 released)
• Module IV: FCBGA Package (2020 Q4 released) NEW
• Module V: FcCSP Package (2021 Q1)
In addition, the market research and strategy consulting company Yole released the annual Advanced Packaging technology & market report: Status of the Advanced Packaging Industry 2020.
Yole’s analysts will also be part of the Technology Unites Global Summit. Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement will do a presentation about the Advanced Packaging Market, during the Advanced Packaging Forum on February 16, 2021 at 11:00AM.
Stay tuned to i-Micronews to get further information about our Advanced Packaging, Semiconductor Manufacturing & Memory activities!

FCBGA: Flip Chip Ball Grid Array
AI: Artificial Intelligence
HPC: High Performance Computing
WLCSP: Wafer Level Chip Scale Package
IC: Integrated Circuit
HBM: Human-Body Model
CPU: Central Processing Unit

SoC : System on a Chip
CuP : Cu Pillar
TDP : Thermal Design Power
PMIC : Power Management Integrated Circuits
PMU : Power Management Unit
RF : Radio Frequency
FO: Fan-Out