ADVANCED PACKAGING INDUSTRY UPDATE - SYNAPS

Advanced packaging is crucial for the ambition of semiconductor companies
SYNAPS 2021 - Advanced Packaging & System Integration Technology Symposium, 2021 edition

Extracted from:
Status of the Advanced Packaging Industry 2020 report, Yole Développement
Advanced Packaging Quarterly Market Monitor, Yole Développement, Q4 2020

OUTLINE:

  • Market forecasts:
    The advanced packaging market is expected to grow at 6.6% CAGR 2019-2025, reaching US$42 billion in 2025. By technology platform: the highest revenue CAGRs is expected from 2.5D / 3D stacking IC , embedded die, and fan-out. Yole announces 21%, 18% and 16% of the total market, respectively.
  • Supply chain:
    TSMC, Intel, Samsung, Amkor, ASE etc… are all actively involved in the advanced packaging market space.
  • COVID-19 Impact:
    Due to the outbreak of COVID-19, the advanced packaging market is expected to decrease by 6.8% YoY in 2020. However, Yole’s analysts are quite positive and expect this market to rebound in 2021.
  • SYNAPS 2021 - Advanced Packaging & System Integration Technology Symposium, 2021 edition on May 18-20, 2021. Register on i-Micronews.
  • TO DOWNLOAD THE PRESS RELEASE: ENGLISH - CHINESE.

“Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach,”asserts Favier Shoo, Team Lead Analyst, Advanced Packaging at Yole Développement (Yole).
With a 6.6% CAGR between 2019 and 2025, the advanced packaging market is expected to more than double its revenue over the period. Yole’s advanced packaging team estimates revenue to be US$42 billion in 2025. This is almost triple the expected growth rate for the traditional packaging market, which is growing at 2.2% CAGR in the same period.

In this dynamic context and encouraged by 7 consecutive years of successful symposiums that have attracted more than 200 participants on average, Yole and its partner NCAP are proud to announce this year again, the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors – SYNAPS, May 18-20, 2021.
As a digital event, SYNAPS offers a unique place in the world where leading companies can share their vision of the advanced packaging industry, evaluate the emerging platforms, and identify business opportunities. SYNAPS’s aim is to deliver a comprehensive understanding of the status of the advanced packaging industry and help companies to be part of the ‘tomorrow’ industry. Register on i-Micronews.

Indeed, Yole investigates disruptive advanced packaging technologies and related markets in depth, to point out the latest innovations and underline the business opportunities. In this regard, Yole proposes an impressive collection of reports and monitors. Amongst this collection, there are:
•  The Status of the Advanced Packaging Industry 2020 report follows the evolution of the industry, offers an understanding of the market and key strategies of the leading advanced packaging companies and much more...
•  The Advanced Packaging Quarterly Market Monitor is published every beginning of March (Q1), June (Q2), September (Q3) and December (Q4)...
Aim of these services is to provide an in-depth coverage of rapidly changing market dynamics and main players’ status and strategy. What is the status of the advanced packaging industry? How is it evolving? Which platforms are dominating the market? What are the underlying applications and their evolution? What is the impact of the COVID-19 outbreak? …Yole is following the evolution of the industry and technologies all year long and is pleased to announce today, with its partner NCAP China, SYNAPS 2021.

The advanced packaging market is pulling in big players from all levels of the semiconductor supply chain. TSMC, Intel, Samsung, Amkor, ASE etc… are all actively involved in this market space, well positioned to capture the business value. Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this industry to explore new eras and innovate. And today, advanced packaging technologies are the key to bridge the gap between die and PCB.
Due to the impact of COVID-19, the advanced packaging market is expected to decrease by 6.8% YoY in 2020.
“However, at Yole we are quite positive and expect this market to rebound in 2021, with about 14% YoY growth”, asserts Emilie Jolivet, Director, Semiconductor, Memory & Computing at Yole.
Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea explains:
“The highest CAGR revenue is expected from 2.5D / 3D TSV IC, embedded die, and fan-out with 21.3%, 18%, and 16% market share, respectively. Adoption is clearly being accelerated by data-driven products shaped by new users’ behavior as a consequence of COVID-19, from the surge in digital entertainment, remote working and scaling of digital operations.”
For example, fan-out in mobile, networking, and automotive; 3D stacking in AI /ML , HPC , datacenters, CIS , and 3D NAND; and embedded die in automotive, mobile, and base stations. By revenue segment, the mobile & consumer market constituted 85% of total advanced package revenue in 2019, and Yole predicts a 5.5% CAGR to constitute 80% of total advanced packaging revenue by 2025. In parallel, telecom & infrastructure is, in revenue, the fastest-growing segment. This segment represents about 13% of the total advanced packaging market. Yole’s analysts expect it will increase its market share from 10% in 2019 to 14% by 2025. Meanwhile, in terms of revenue, the automotive & transportation segment will grow at a 10.6% CAGR during the period 2019 – 2025, reaching about US$1.9 billion in 2025.

It is a fact. Advanced packaging is at the heart of innovation. Especially for the semiconductor industry where megatrends are bringing new challenges. Leading advanced packaging companies from all over the world will come to exchange ideas on their vision and future perspectives at SYNAPS, 2021 edition.
From Xiao Ke, General Manager of NCAP China:
“There is no doubt that COVID-19 has posed challenges to the world. But it has also had a positive impact on the semiconductor industry because it has changed the living and working life, such as work from home and investment in automation in factories, which will definitively lead to rapid growth in the demand for computing, microprocessors, and memory devices. In this context, 2021 will be a year full of opportunities for the semiconductor industry. Yole and NCAP China wish to promote international communication and global cooperation in the advanced packaging industry and boost the global semiconductor industry by organizing SYNAPS. You are welcome to take part in SYNAPS 2021, to develop your business in China!”

Status of the Advanced Packaging Industry report and Advanced Packaging Quarterly Market Monitor both explore in-depth the field of advanced packaging. In parallel, SYNAPS is the place to be to obtain a comprehensive yearly view of the latest market updates and technology developments. Make sure to get a relevant understanding of this industry and follow us on i-Micronews.com.

All year long, Yole Développement publishes numerous advanced packaging related reports and monitors. In addition, experts realize various key presentations and organize key conferences. Make sure to be aware of the latest news coming from the industry and get an overview of our activities, including interviews with leading companies and more on i-Micronews.
Stay tuned!




Acronyms:
CAGR: Compound Annual Growth Rate
IC: Integrated Circuit
YoY: Year-over-Year
NCAP: National Center for Advanced Packaging
AI: Artificial Intelligence
ML: Machine Learning
HPC: High-performance Computing
CIS: CMOS Image Sensor



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