Yole and NCAP symposium

“Collaborative innovation across the supply chain is necessary for the development and commercialization of advanced packaging technologies”… says NCAP

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LYON, France – October 3rd, 2014 – Both partners, National Center for Advanced Packaging (NCAP China) and Yole Développement (Yole) confirm the success of their collaboration, with the 2014 Advanced Packaging & Integration Technology Symposium. This event is the first step of a promising collaboration between both organizations. “Such success was possible thanks to the great collaboration with NCAP, presentations and active participation of the audience”, says Yole.

Yole reaffirms its interest for the advanced packaging industry in Greater China; the market research, technology and strategy consulting company would like to ensure business positioning and increase its existing network in this geographic area.

During NCAP & Yole symposium, numerous relevant presentations and discussions took place. Key players of the advanced packaging area attended this event and exchanged their vision on the growth of this segment, the challenges seen in the industry with the new emerging technologies and the new solutions developed to address them.

The first advanced packaging event organized by NCAP and Yole took place last month in Wuxi, China. The one-day event attracted international participation from 48 organizations, with strong high level (52% executives) and Chinese (70%) representation. During this symposium, participants discovered an impressive program including twelve industrial presentations and a panel session covering the advanced packaging industry, its main technologies, manufacturing readiness of the newer platforms and future trends.

“Such success was possible thanks to the great collaboration with NCAP, presentations and active participation of the audience”, says Yole

Aim of the symposium was to present the status of the advanced packaging industry and its latest innovations: interposers, 3D integration technologies, sensors, related MEMS packages, and manufacturing processes. All topics have been addressed by industrial experts from various organizations across the supply chain.

Several presentations and panel discussions focused on the fan-out technology and manufacturing readiness at panel level. Max Lu, Deputy Director of Engineering Center, SPIL, presented, during “Interposer & 3D Integration Technology” session, SPIL’s fan-out activities. “At SPIL, we are developing our own fan-out technology which able to fulfill the next generation mobile and networking product application”, says Max Lu. 12” wafer form is the current focus and SPIL will continue monitor the industry infrastructure readiness of panel level.

During the “Manufacturing Challenges“ session, Jérôme Azémar, Technology & Market Analyst, Advanced Packaging at Yole Développement, highlighted the high interest of embedded technologies including fan-out and embedded dies technologies. “Fan-out and embedded dies are two promising packages”, says Jérôme Azémar. “They allow better integration, better electrical performance, better heat management and even lower cost depending on the application. The discussions we had during the symposium highlighted the added-value of panel manufacturing for fan-out and the need of further developing the infrastructure to support it”, he adds… (Source: Embedded die and FOWLP report, Yole Développement, to be released Q4, 2014).

During the “Sensors and MEMS packages” session, Herb Huang, Ph. D, Senior Director at SMIC, mentioned about availability today in the industry of several new packaging technologies, including Trough-Silicon-Via (TSV). Dr. Huang comments: “TSV alone is not an assumed technology solution for automatic 3D upgrade or replacement of existing SiP and system approaches should be taken in design and commercialization of TSV based 2.5/3D SiP and 3DIC”.

Albert Ou, Manager of Corporate R&D at the ASE Group outlined: "Several TSV scenarios, a Wafer Level Assembly-enabled Wafer Level SiP (WL SiP) platform, and a new form factor standard to develop the industry's smallest sensor."
“The Advanced Packaging Technology Symposium has been a great source of information exchanges and networking. We had several discussions and questions during all the sessions and a very interactive debate”,
comments Rozalia Beica, CTO & Business Unit Director, Advanced Packaging and Semiconductor Manufacturing at Yole.“This event has been a great success and this could not have been possible without the great collaboration between NCAP and Yole and participation of all the speakers and engaging audience”, she adds.
Interposers have been also part of the main discussions. Main exchanges highlighted that such technology will not only be for high-end packages in the future. “Lower cost options are being developed such as glass and organic based interposers and could become potential solutions for low and mid-end applications”, reports Jérôme Azémar, Yole (Source: 3DIC & 2.5D TSV Interconnect for Advanced Packaging 2014 Business Update, October 2014).

Dongkai Shangguan, CEO at NCAP, says: “Collaborative innovation across the supply chain is necessary for the development and commercialization of advanced packaging technologies in the industry. NCAP will continue to partner with OEM’s and IC design houses, as well as foundries, OSATs, and equipment and materials suppliers, to develop total solutions in order to address the future technological needs of the packaging industry. We are forming several industry consortia around certain critical technical areas, and we welcome the active participation of our partners from the industry.”

Based on this success, NCAP and Yole are announcing the continuation of this collaboration and establishment of an annual event of the Advanced Packaging & Integration Technology Symposium. NCAP and Yole will keep the Advanced Packaging Community informed about the organization of this event.

For further information about the Advanced Packaging Technology Symposium, 2014 session, please contact: Camille Veyrier (veyrier@yole.fr).