ADVANCED PACKAGING INDUSTRY - FAN OUT FOCUS - NCAP & YOLE SYMPOSIUM

Advanced Packaging: game-changer for semiconductor revolution

Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China
Source: Fan-out Packaging: Technologies and Market Trends report, Yole Développement, 2019

OUTLINES:

  • NCAP CHINA & Yole Développement (Yole) build an innovative program fully dedicated to the advanced packaging industry: the Advanced Packaging & System Integration Technology Symposium
  • In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
  • Significant new developments in a dynamic Fan-Out landscape.
  • Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.

TO DOWNLOAD THE PRESS RELEASE:

 • ENGLISH VERSION

 • CHINESE VERSION


LYON, France – April 4, 2019: Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, AI & HPC …
The market today is dominated by large IDMs , such as Intel and Samsung, top 4 global OSATs and foundry with packaging house - TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, Fan-Out packaging, 3D TSV and more… to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.
A few years ago, Yole Développement (Yole) and NCAP China decided to create a unique place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities.
Today, both partners confirm their success with the 5th Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry.

With unique access to leading players and experts, the Advanced Packaging & System Integration Technology Symposium will take place in Shanghai at the end of the month and presents 5 key industry focuses: AI & HPC, memory & computing, transportation, 5G and consumer. The Organizing Committee is offering about 20 inspiring presentations, 2 market briefings and several networking times to cover a broad range of topics...
Make sure you are part of the 2019 Symposium and register right now on i-micronews.com!

In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB , RF , and PMU . But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, the market value increased 4x by 2018. Thus, the HD Fan-Out market segment was created, reducing the market-share ratio of OSATs.
Today, the fastest growing platform is, without doubt, Fan-Out packaging, with 25% CAGR growth and experiencing a diversification of its targeted applications beyond the consumer world. Moreover, this year Fan-Out packaging appears once again to be one of the most dynamic technologies, though needing a new wave of cost decreases to become even more widespread. This shall be achieved thanks to the move toward panel scale, once ambitious challenges have been overcome by the industry. The Fan-out market will reach almost US$3.8 billion by 2024 .
The Advanced Packaging & System Integration Technology Symposium program follows the industry evolution and the emergence of innovative technologies. Based on the Fan-Out attractiveness, Yole and NCAP China propose several impressive presentations focused on this advanced packaging platform, especially with Bosch Sensortec’s keynote presentation: Mrs Bin Fu, Head of Business Development and Marketing, China, at Bosch Sensortec will take a closer look at how smarter sensors can contribute to the edge IoT edge trend, from the perspective of a sensor solution innovator.

In parallel, Farhang Yazdani, President & CTO, Broadpak, will be delivering the keynote presentation dedicated to the AI & HPC megatrend: “Semiconductor industry is at a turning point: the slowdown in CMOS scaling and escalated costs have prompted the industry to rely on IC packaging industry to extend the benefits of more-than-Moore era”, asserts Farhang Yazdani from Broadpak.

This Shanghai symposium has the opportunity to welcome leading companies as speakers: Amkor Technology, AT&S China, BESI, Bosch Sensortec, Boschman Advanced Packaging Technology, Brewer Science, Broadpak, China WLCSP, ERS electronic, JCET, KLA, Kulicke & Soffa, NCAP China, SiPlus, SPIL, System Plus Consulting, TDK InvenSense, TD-Sien Integrated Circuit, Unisoc, Visionox Technology, Xilinx and Yole Développement.
Moreover, the 2019 Symposium is supported by:
SPTS Technologies, an Orbotech Company, ULVAC, Besi, Bowman, Hanmi, ERS Electronic, Kulicke & Soffa and ASM Assembly Systems.

Yole Développement’s packaging and substrate analysts invite you to gain an in-depth understanding of the industry evolution and technology issues, with two dedicated market briefings focused on AI & HPC, memory & computing, transportation, consumer and 5G, moderated by Yole’s Semiconductor & Software team:
Emilie Jolivet - Division Director, Favier Shoo - Technology & Market Analyst and Santosh Kumar - Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea, as well as Thibault Buisson, the Chief Operating Officer.
They will describe the new ecosystem currently emerging, pushed by the needs of innovative and disruptive technologies. Analysts will also detail the industry evolution and its consequence at each step of the supply chain.
An exciting and dynamic period is coming.
Welcome to a new semiconductor world! Registration & sponsorship opportunities are available on i-micronews.com.

Source: Fan-out Packaging: Technologies and Market Trends report, Yole Développement, 2019

Acronyms:
AI : Artificial Intelligence
HPC: High Performance Computing
IDM: Integrated Device Manufacturer
OSAT: Outsourced Semiconductor Assembly and Test
TSV : Through Silicon Via
BB : Baseband
RF : Radio Frequency
PMU : Power Management Unit
HD : High Density



Connect with us


About the Fan-Out report:

Newsletter subscription

About Yole Développement