| ABOUT YOLE DEVELOPPEMENT
Founded in 1998, Yole Développement, the "More than Moore" market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services.
Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base...
The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business...
Our fields of expertise:
MEMS & Sensors - Imaging - Medical Technologies - Compound Semiconductors - LED - Displays - Photonics - Power Electronics - Batteries & Energy Management - Advanced Packaging - Semiconductor Manufacturing.
| WEBCAST PROGRAM POWERED BY I-MICRONEWS.COM
TSV technology: a key platform for heterogeneous integration
On Jan. 16 at 5:00 PM CET
Is 3D TSV only a solution for high end devices? TSV could penetrate the market for devices in high-end graphics, high-performance computing, networking and data centers. However It is also a key enabler for heterogeneous integration in segment such as MEMS & sensors, LED, RF components. What will be the future of this technology?
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and high performance applications. In the semiconductor industry, 3D integration using TSV has been considered to be a promising way for improving performance and density. Indeed, by connecting stacked chips with the TSV vertical connections, the wide bandwidth I/O and reduction of interconnects length can be achieved. The market for 3D TSV technology will continue to grow... REGISTRATION
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