2021 Press Releases

LATEST HEADLINES

	APRIL 14 - MEMS & SENSORS - YOLE MEMS pressure sensors: much more than “business as usual" The automotive market is still driving revenues for MEMS pressure sensors – but for how long? “Pressure sensors are widely used throughout the industry across numerous applications.” asserts Dimitrios Damianos, Technology & Market Analyst at Yole Développement (Yole): “In the last couple of decades, automotive has been one of the main sectors to drive demand for these devices. The development of new systems in conventional internal combustion engine vehicles, as well as hybrid electric vehicles, is demanding complex control systems”... PRESS RELEASE: ENGLISH
	APRIL 9 - ADVANCED PACKAGING - YOLE GROUP 5G: advanced packaging technologies bring innovation 5G packaging brings innovative technology and new opportunities for SiP business. “The RF components in the mobile are packaged at two levels,” asserts Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea at Yole Développement (Yole): “The 1st-level packaging of various RF components like filters, switches, and amplifiers at die/wafer level, includes RDL , TSV , and/ or bumping steps. Then the 2nd-level SiP packaging is performed at the SMT level where various components are assembled on SiP substrate along with passives.”... PRESS RELEASE: ENGLISH
	APRIL 1 - DISPLAY - YOLE MicroLED IP: startups and newcomers are challenging the heavyweights Joining Apple, Samsung, LG, XDisplay, PlayNitride, Facebook and others, newcomers are accelerating microLED patenting activity. “We estimate that as of Q1 2021, more than US$5 billion has already been spent on microLED development. Indeed, 37% have been spent on other company internal R&D and investments, 26% in Apple internal R&D, 24% were investments in startups and 13% have been spent in acquisitions.” asserts Eric Virey, Principal Analyst, Technology & Market, Displays at Yole Développement (Yole)... PRESS RELEASE: ENGLISH - KOREAN - JAPANESE - CHINESE
	APRIL 1 - POWER ELECTRONICS - YOLE DC charging for EV: a decisive outlook for the power electronics industry The total market value of power electronic devices for DC chargers will grow to US$347 million by 2026. “While low-power DC chargers, up to 20-30 kW, are commonly based on a monolithic design approach, the modular design is dominant in high-power chargers.” asserts Milan Rosina, PhD, Principal Analyst, Power Electronics and Batteries at Yole Développement (Yole)... PRESS RELEASE: ENGLISH - GERMAN
	MARCH 25 - RF - YOLE 5G is driving the RF front-end components market growth for telecom infrastructure The RF component market for telecom infrastructure will peak at $4.2B in 2023 thanks to active implementation of 5G. “The development of AAS for urban coverage, for both LTE and 5G equipment, can be seen as the main game changer in the telecom infrastructure RF component industry in the past few years.” asserts Cédric Malaquin, Technology & Market Analyst, RF Devices & Technology at Yole Développement (Yole)... PRESS RELEASE: ENGLISH - JAPANESE
	PROCESSOR QUARTERLY MARKET MONITOR, Q1 2021 - YOLE DEVELOPPEMENT Market Dynamics: • Key figures: The APU market should generate US$44 billion of revenue for designers in 2021. Revenue for CPU s are expected to grow to US$70 billion in 2021. GPU s continue to grow, with US$15 billion revenue in 2020 reaching beyond US$25 billion in 2025 • US-China trade disputes – Status: China is looking to preserve the Huawei’s long-term viability... Q1 2021 MONITORS PRESS RELEASE : ENGLISH - JAPANESE - KOREAN
	MARCH 19 - PACKAGING - YOLE High-End performance packaging: what are the impacts of the big players on the supply chain? “High-end Packaging technology options are increasingly rich and ground-breaking. WLPs are changing the standard of FE/BE supply chain.” asserts Favier Shoo, Team Lead Analyst, Packaging at Yole Développement (Yole)... PRESS RELEASE: ENGLISH
	DRAM & NAND QUARTERLY MARKET MONITORS, Q1 2021 - YOLE DEVELOPPEMENT Market Dynamics: • The memory market grew 15% to reach US$122 billion in 2020. • NAND Q4 2020: NAND market revenue grew 28% in 2020. NAND’s competitive landscape remains incredibly dynamic. As the NAND market evolves, the industry faces many important questions… • DRAM Q4 2020: DRAM market revenue grew 6% in 2020. The DRAM market is constantly evolving and changing. The DRAM market’s future promises to be as dynamic as its past… Q1 2021 MONITORS PRESS RELEASE : ENGLISH - KOREAN - CHINESE
	MARCH 17 - MEMS & SENSORS - YOLE Ultrasound: more than a choice, a strategic positioning for players “Beyond the technological choices, there are players who wish to offer new functions to OEM system manufacturers for which bulk piezoelectric technologies could not provide adequate solutions.” asserts Jérôme Mouly, Team Lead Analyst, Sensing & Actuating at Yole Développement (Yole)... PRESS RELEASE: ENGLISH
	MARCH 11 - SEMICONDUCTOR MANUFACTURING - YOLE Glass for semiconductors: many applications, few players “Today, the scope for applications using glass substrates in the semiconductor field is broad and highly diversified.” asserts Amandine Pizzagalli, formerly Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole) and today Finance Project Manager at Yole Finance, part of Yole. She adds: “Nowadays, the number of glass vendors able to deliver wafers and panels with the specifications the industry needs is quite limited”... PRESS RELEASE: ENGLISH
	MARCH 8 - SOFTWARE & COMPUTING - YOLE GROUP M1: Apple did it “Two new Apple MacBook models and the Mac mini are now powered by an Apple in-house SoC design,” announces Belinda Dube, Technology & Cost Analyst, Memories at System Plus Consulting. And she adds:“The transition from Intel x86 processors has created shockwaves felt throughout the processor and computing world. This new, first SoC for Mac features 4-CPU high-performance cores, 4-CPU high-efficiency cores, and 8-GPU cores.”... PRESS RELEASE: ENGLISH - CHINESE
	MARCH 4 - RF ELECTRONICS - YOLE GROUP RF front-end module industry What are the technical choices made by Apple? “In the iPhone series from 2016 to 2020, Apple’s strategy was to reduce the RF area size with a decrease of the board level at first until 2017.” asserts Stéphane Elisabeth, PhD, Cost Analyst in RF and Advanced Packaging at System Plus Consulting. “But since, the board is increasing along with a stabilization of the RF share mainly even with 5G integration. Between 2017 and 2020, Intel was the only modem and transceiver (RxTx) supplier for Apple. Qualcomm who lost the market in 2017, is getting in the iPhone design in 2020 and is likely to be kept in 2021 because of the 5G. In 2022, in-house modem and RxTx could be expected from Apple.” PRESS RELEASE: ENGLISH - CHINESE

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	FEBRUARY 25 - POWER ELECTRONICS - YOLE GROUP E-mobility: towards SiC adoption “There are basically three converter types in an electric car: the main inverter, DC/DC and OBC .”asserts Ana Villamor, Technology & Market Analyst, Power Electronics at Yole Développement (Yole). “The main inverter is the largest market among the different converters due to the higher power levels, leading also to the highest content of power semiconductors.” More on Power SiC – Life in The Fast Lane as SiC Penetration Accelerates – Webcast on March 4, 2021. Register on i-Micronews. PRESS RELEASE: ENGLISH
	FEBRUARY 17 - SYNAPS - YOLE DEVELOPPEMENT Advanced packaging is crucial for the ambition of semiconductor companies “Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach,”asserts Favier Shoo, Team Lead Analyst, Advanced Packaging at Yole Développement (Yole)... More on SYNAPS 2021 - Advanced Packaging & System Integration Technology Symposium, 2021 edition on May 18-20, 2021. Register on i-Micronews. PRESS RELEASE: ENGLISH - CHINESE.
	FEBRUARY 11 - MEMORY - YOLE GROUP Embedded and stand-alone NVM: two different futures? “The overall emerging NVM market will grow at a CAGR20-26 ~44% ”. asserts Simone Bertolazzi, Market & Technology Analyst, Memory at Yole Développement (Yole).“After several years in development, embedded emerging NVM technologies have gained significant maturity and are now ready for market take off.”... PRESS RELEASE: ENGLISH - KOREAN - CHINESE
	FEBRUARY 10 - IMAGING - YOLE GROUP FLIR Boson 640 Pro: what is this market-leading product worth? “The Boson camera from FLIR is a compact LWIR thermal camera module, available in different versions,” states Joël Thomé, CEO at PISEO, part of Yole Group of Companies. Fueled by multiple drivers, including the need to measure the temperature of many people due to COVID-19 as well as the need for surveillance, the market for IR thermal imaging cameras and modules is expanding at a rapid pace. PISEO’s partner, Yole Développement (Yole), expects an 8% CAGR between 2019 and 2025... PRESS RELEASE: ENGLISH
	FEBRUARY 5 - POWER ELECTRONICS - YOLE GROUP Si IGBT is leading the power electronic industry “Silicon devices such as IGBTs are benefiting from mature infrastructure and processes. New device generations are coming to the market. In addition to performance improvements, Si IGBT costs will further be reduced thanks to a 12-inch Si wafer transition that will make the competition with WBG materials even tougher.” asserts Amine Allouche, Technology & Cost Analyst at System Plus Consulting... PRESS RELEASE: ENGLISH - CHINESE
	JANUARY 27 - IMAGING - YOLE Machine vision, a growing market driven by industrial and automation applications “The displacement of CCD by CIS has favored volume growth of the machine vision market”. asserts Richard Liu, Technology and Market Analyst in the Photonics, Sensing & Display division at Yole Développement (Yole).“This greatly simplifies the complexity of the industrial cameras. Compact cameras, including smart cameras, can more easily be developed and are more suitable for use in various industrial environments”... PRESS RELEASE: ENGLISH
	ADVANCED PACKAGING QUARTERLY MARKET MONITOR, Q4 2020 - YOLE DEVELOPPEMENT Q4 2020, Market Dynamics: • FCBGA package revenue is expected to reach US$12 billion US USD by 2025 from $10 billion in 2020, driven by AI , datacenter and HPC momentum. • FCBGA packages are expected to reach 3% CAGR4 over the next five years (in revenue). • FCBGA revenue is expected to surpass US$10 billion by 2025. • The majority of wafer demand stemming comes from 3D stacked devices with total wafer growth CAGR at 8.5% compare to 2020... Q4 2020 MONITOR PRESS RELEASE : ENGLISH - CHINESE
	JANUARY 15 - MEMS & SENSORS - YOLE Will future soldiers be made of Semiconductor? “The global market for infantry equipment related to semiconductor technology will evolve from US$9.1 billion in 2020 to US$17.5 billion in 2030.” asserts Alexis Debray, Technology & Market Analyst, MEMS, Sensors & Photonics at Yole Développement (Yole). Although the usual narrative states that the world has enjoyed peace and prosperity since the end of World War II, in reality global military spending has grown from US$17 billion in 1949 to US$1,868 billion in 2019... PRESS RELEASE: ENGLISH
	JANUARY 7 - COMPUTING & SOFTWARE - YOLE Server computing, a market propelled by AI and data-intensive “Between new opportunities and requirements brought by 5G, high-end AI and HPC computing workloads, and growing pressure to limit and in fact reduce power consumption, the datacenter server computing market is facing many technical challenges.” asserts Adrien Sanchez, Technology & Market Analyst, Computing & Software division at Yole Développement (Yole)... PRESS RELEASE: ENGLISH