2019 Press Releases

MEDIA CENTER


LATEST HEADLINES

JULY 18  COMPOUND SEMICONDUCTORS - YOLE DEVELOPPEMENT

SiC industry: ready for take-off?

The adoption of SiC power devices is now undeniable. The power electronics industry has no more questions about it. Today, questionings are more related to the companies and the playground: how and when they will make it…
Based on discussions with leading SiC players, Yole Group of Companies including Yole Développement (Yole), System Plus Consulting and Knowmade, sees a prospering SiC power device market. The 3 companies are working together to get a comprehensive understanding of the SiC technologies, their evolution, the market segments and competitive landscape...
  

PRESS RELEASES: ENGLISH

JULY 17  POWER ELECTRONICS - YOLE DEVELOPPEMENT

The inverter industry is building a momentum for change

“The power electronics industry is strong driven by EV/HEV development and even stronger is the impact in the global inverter market,” announces Ana Villamor, PhD. Technology & Market Analyst at Yole Développement (Yole).
The inverter market keeps steadily growing, boosted by electrification and CO2 reduction targets. The EV market segment is today driving the development of the inverter industry, with different applications such as charging infrastructure, renewables and energy storage. With 27% CAGR between 2018 and 2019, this sector is also showing impressive technological innovations that answer the market demand…
Yole announces its technology & market report, Status of the Inverter Industry....
  

PRESS RELEASES: ENGLISH

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 MEDICAL TECHNOLOGIES AND IMAGING - YOLE DEVELOPPEMENT

July 9 - X-ray for medical, veterinary, industrial & security applications: new technologies reach the commercialization phase

“The X-ray detector market reached US$2 billion in 2018 driven by the medical segment,” announces Marjorie Villien, PhD. Technology & Market Analyst at Yole Développement (Yole).“The medical sector accounts for 75% of the global X-ray market, but the industrial and security market are step by step gaining share.”
With its new report, X-Ray Detectors for Medical, Industrial and Security Applications, the Life Sciences & Healthcare team from Yole, proposes a comprehensive overview of the X-ray technologies and related applications...
  

PRESS RELEASES: ENGLISH

ADVANCED PACKAGING - YOLE DEVELOPPEMENT

July 8 - The advanced packaging, a wonderful world

The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on IC packaging to extend the benefits of the More-than-Moore era. Thus, advanced packaging has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and megatrends in transportation, 5G, consumer, memory & computing, IoT (and IIoT ), AI , and HPC.
The market research & strategy consulting company, Yole Développement (Yole) releases today its annual technology & market analysis, Status of the Advanced Packaging Industry. This report explores the field of advanced packaging...   

PRESS RELEASES: ENGLISH

IMAGING - YOLE DEVELOPPEMENT

July 8 - CIS industry: Yole’s analysts expect a 10.1% year on year growth rate for 2019

“CIS has become a key market segment in the semiconductor industry, reaching US$15.5 billion in 2018”, asserts Chenmeijing Liang, Technology & Market Analyst, Photonics, Sensing and Display at Yole Développement (Yole). And Yole’s analyst adds: “And it should exceed 3% of the total semiconductor sales”.
This segment has seen Sony become a significant semiconductor player, alongside other CIS players such as Samsung, OVT, and ON Semiconductor. Innovative approaches like wafer stacking technologies have emerged specifically for CIS, and have become key developments for the semiconductor market in general. In the context of a fierce rivalry in the technology sector, imaging has become a key focal point of OEMs and the entire semiconductor supply chain.
The market research & strategy consulting company announces today a new product, published in quarterly instalments. Titled CIS Service – Imaging Research...   

PRESS RELEASES: ENGLISH

ADVANCED PACKAGING - YOLE GROUP OF COMPANIES

June 27 - TOP 25 OSATs ranking: survival of the fittest?

The leading giant of the OSATs , ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has just got even bigger after the official acquisition of SPIL on April 30 2018. In 2018e, ASE Technology Holding Co., Ltd and subsidiaries made a new record-high revenue of US $12,308 billion, which is almost three times of Amkor’s second-in-place revenue, US$4,316 billion. Even if SPIL and USI revenues are separated from ASE Technology Holding Co., Ltd. and subsidiaries, the former ASE Inc. business revenue was US$5,250 million in 2018, which is still the highest amongst other OSATs leaders.
“On the other hand, if we only take into account the YoY growth of each company, the analysis will be very different”, explains Favier Shoo, Technology & Market Analyst at Yole Développement (Yole) ...   

PRESS RELEASES:
ENGLISH

COMPOUND SEMICONDUCTORS - YOLE GROUP OF COMPANIES

June 27 - Emerging semiconductor substrates: what will be the next game-changer? 

Under this context, alternative platforms and compound semiconductors have emerged and the semiconductor industry is showing today lot of success stories: GaAs for RF and photonics applications, SiC for power and RF applications, GaN -on-sapphire for LEDs , and SOI for RF and CIS imaging sensors and more. Without doubts, electronics and photonics applications are creating plenty of opportunities for emerging semiconductor substrates. Combined, Yole Développement (Yole) expects the emerging semiconductor substrate market to surpass US$400 million, growing at a 24% CAGR between 2018 and 2024.   

PRESS RELEASES: ENGLISH

JUNE 27  LIFE SCIENCE & HEALTHCARE - YOLE GROUP OF COMPANIES

June 27 - Medical wearables: the convergence of two worlds, medical-grade devices vs. consumer wearables

“In today’s wearable technology market, the vast majority of growth has been in consumer sports, fitness, and wellness,” announces Jérôme Mouly, Senior Technology & Market Analyst at Yole Développement (Yole).“However, wearable devices are rapidly expanding for health and medical uses. At Yole, we think, this market should reach US$32 billion by 2024 with a year-to-year 31% growth between 2018 and 2024. In the meantime, the global sensor market for medical wearables, including CGM , is expected to reach US$2.8 billion in 2024, with a 21.6% CAGR during the same period.”
Smartphone ubiquity, sensor miniaturization, and ease of integration have increased the number of wearable products on the market, to the point where such products are now achieving performance levels suitable for medical use-cases.
But how will medical wearables make patients healthier – and why now? 

PRESS RELEASES: ENGLISH

SOLID-STATE LIGHTING - YOLE GROUP OF COMPANIES

June 26 - VCSEL, an industry driven by new functionalities in smartphone and automotive

“Today, up to three VCSEL dies can be integrated in a smartphone,” comments Sylvain Hallereau, Project Manager from System Plus Consulting “3D recognition with the flood illuminator, the dot projector and the proximity sensor, all are based on VCSEL laser components. Already integrated in flagship smartphones, these functions will quickly find a home in all smartphones, causing a sharp increase in VCSEL demand.”
Therefore, the global VCSEL market should surpass US$3.7 billion by 2024, growing at a 31% CAGR between 2018 and 2024. The consumer market segment largely contributes to these impressive figure with a market value of US$3.4 billion by 2024. Behind the smartphone applications, the automotive sector with emerging 3D sensing functionalities is also playing a key role. Yole Développement (Yole) announces a 185% CAGR between 2018 and 2024 as well....  

PRESS RELEASES: ENGLISH

RF ELECTRONICS - YOLE GROUP OF COMPANIES

June 24 - RF industry: how can GaN win the battle?

Over recent years, GaN has been significantly adopted by the RF industry owing to its higher power output at high frequencies, and its smaller footprint.
“The overall GaN RF market is expected to reach US$2 billion by 2024, driven by two main applications: telecom infrastructure and defense”, asserts Ezgi Dogmus, PhD. Technology & Market Analyst at Yole Développement (Yole).
And Antoine Bonnabel, Technology & Market Analyst, also part of the Power & Wireless team at Yole comments: “Worldwide investment in telecom infrastructure has remained stable in the past decade, with a recent increase coming from Chinese government efforts. But in this steady market, the trend toward higher frequencies offers a sweet spot for RF GaN in PA in 5G network at frequencies below 6GHz, in RRH .”…
Yole Group of companies, including Yole and Knowmade investigates GaN technologies for RF applications to propose each year up-to-date technology, market and patent analyses...

PRESS RELEASES: ENGLISH - GERMAN


IMAGING - YOLE GROUP OF COMPANIES

June 20 - Imaging technologies are transforming the automotive industry

Cameras are now standard equipment for automobiles, with 124 million image sensors shipped in 2018. Automotive camera modules have reached US$3 billion and are expected to grow at an 11% CAGR, reaching US$5.7 billion by 2024, announces Yole Développement (Yole) in its latest imaging report, Imaging for Automotive.
Over the past five years, viewing applications have been at the core of market growth – with rearview, surround-view, and black box becoming ubiquitous. ADAS cameras, which currently represent 40% of the business, will provide additional growth for years to come thanks to growing adoption rates. As an example, ZF, one of the largest tier one suppliers of automotive systems, last year released its fourth Generation S-Cam with two solutions, one with a mono camera and the other with a triple camera set-up…

PRESS RELEASES: ENGLISH

MEMORY - YOLE GROUP OF COMPANIES

June 18 - Memory business: applications are driving the long-term growth

Despite some cyclicality and seasonality, the stand-alone memory market has experienced extraordinary growth over the past decade. This has been driven by important megatrends, such as mobility, cloud computing, AI , and IoT.
“NAND and DRAM account together for around 97% of the overall stand-alone memory market”, announces Simone Bertolazzi, Market & Technology Analyst, Memory at Yole Développement (Yole).“Their revenues hit a record high of around US$160 billion in 2018, registering an impressive CAGR of 32% between 2016 and 2018.”
Yole Group of Companies including Yole, System Plus Consulting and Knowmade is daily working with the leading memory players to collect valuable market and technology data...

PRESS RELEASES: ENGLISH

ADVANCED PACKAGING - YOLE GROUP OF COMPANIES

June 12 - Advanced substrates: the wind of change

Historically, the IC substrate and board industry has assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players.
“Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).“As the mobile segment matures with saturating growth, the value creation efforts are shifting towards emerging products, especially in Telecom & infrastructure (datacenters, 5G) and automotive.” ...

PRESS RELEASES: ENGLISH

MEMS & SENSORS - YOLE DEVELOPPEMENT

June 10 - MEMS: who is leading the race?

For another year, Broadcom and Robert Bosch (Bosch) remain the global MEMS leaders. Almost every player exhibited a stable yearly growth (From 2017 to 2018) though a bit weaker than the previous period (From 2016 to 2017).
Yole Développement (Yole) believes that this smaller than expected growth of the MEMS players during 2018 reflects a modest re-adjustment of growth of the semiconductor industry.
Do not get us wrong: 2018 was the best year so far for the semiconductor industry in general...

PRESS RELEASES: ENGLISH - CHINESE - GERMAN - JAPANESE

POWER ELECTRONICS - YOLE GROUP OF COMPANIES 

May 28 - Discrete power device packaging, a big and slow-growing market

The discrete power devices market represents almost US$13.5 billion in 2018 with a 2.9% CAGR between 2018 and 2024. This industry is clearly well established and mature, confirms Yole Développement (Yole).Therefore, the discrete power device market is following the global rise of the power electronic industry.
In parallel, Yole’s analysts announce a US$3.7 billion market only for the packaging part, with a 1.1% CAGR during the same period. “The discrete power device packaging industry still offers business opportunities, especially for materials suppliers and packaging companies”, comments Milan Rosina, PhD. Principal Analyst, Power Electronics & Batteries, at Yole. ...

PRESS RELEASES: ENGLISH - CHINESE - GERMAN - JAPANESE

SOLID STATE LIGHTING - YOLE GROUP OF COMPANIES 

May 21 - Edge Emitting Lasers (EEL): Yole’s analysts point out the emergence of potential killer applications

Last year, EELs represented a US$2.5B market, announces Yole Développement (Yole) in its latest technology & market analysis, EEL market and technology trends published last month. “This figure should reach more than US$5B by 2024 with a 13% CAGR between 2018 and 2024”, comments Martin Vallo, PhD., Technology & Market Analyst at Yole. “Indeed the growth is still driven by the optical communication market segment with optical systems for datacom and telecom. It is today the largest EELs segment with 56% of the total revenue in 2018.”
However, some killer applications emerge in parallel... The market research and strategy consulting company Yole pursues its investigations towards the SSL world. Analysts combine their expertise from materials to devices including equipment to get a deep understanding of this industry and the status of the technologies. They perform valuable photonic technology and market reports to identify technical breakthroughs and business opportunities. VCSEL , GaAs and EEL are part of the collection of reports proposed by Yole today...

PRESS RELEASES: ENGLISH - CHINESE - GERMAN - JAPANESE

RF ELECTRONICS - YOLE GROUP OF COMPANIES 

May 17 - Antennas for 5G: Samsung, Intel, Ericsson, and Huawei and more have begun extending their portfolios

Today, the IP landscape related to antenna for 5G is still unsettled, announces Knowmade. With more than 75% of patent applications still pending, much will change in the coming years. 
“After an initial period of domestic patent applications, the main IP and market players including Samsung, Intel, Ericsson, and Huawei, have begun extending their portfolios worldwide”,comments Paul Leclaire, PhD. Patent & Technology Analyst at Knowmade. “Samsung and Intel appear to be the two leaders currently best-positioned to limit their main competitors’ patenting activity and freedom-to-operate."...

PRESS RELEASES: ENGLISH - CHINESE - GERMAN - JAPANESE

RF ELECTRONICS - YOLE GROUP OF COMPANIES 

May 2 - Radar for automotive : automated driving applications strengthens market dynamics

In the next few years, autonomous driving will become reality. To achieve this innovation, numerous technologies have been developed to provide functionalities and safety to drivers and passengers. Among the vision technologies, radar systems are the best-established and most secure technology. While both automotive segments, AD and ADAS safety follow different dynamics, both benefit from each other. ADAS is well-established in the automotive industry, with features like AEB becoming standard in 2018 for many middle-end cars from OEMs including Volkswagen, Toyota, Nissan, Honda, Mazda, and Hyundai. Due to the complexity linked to environment perception (i.e. pedestrians crossing a street for instance), radar performance has been continuously improved for safety purposes, which has proven beneficial for the commercial AD market…

PRESS RELEASE: ENGLISH VERSION

PHOTONICS - YOLE GROUP OF COMPANIES 

May 2 - Si Photonics: beyond the tipping point!

The total market for PIC -based transceivers will grow from around US$4 billion in 2018 to around US$19 billion in 2024, from around 30 million units to around 160 million units. These are the impressive figures announces by Yole Développement (Yole) in its latest PICs report released last week, Silicon Photonics and Photonic Integrated Circuits 2019. In collaboration with Jean-Louis Malinge, a world-renowned telecommunication & photonics expert, Yole’s analysts propose today a comprehensive understanding of the PIC applications and related technologies as well as the technical and market challenges with a special focus on Si photonics…

PRESS RELEASE: ENGLISH VERSION

MEMS & SENSORS - YOLE GROUP OF COMPANIES 

April 4 - LiDAR industry: high expectations for autonomous driving

The LiDAR market reached US$1.3 billion in 2018, announces Yole Développement (Yole). For the 2nd time, the market research and strategy consulting company, Yole releases a dedicated LiDAR technology and market report to point out the industry evolution and give insights about the latest innovations.
With its Lidar for Automotive & Industrial Applications report, the company pursues its investigations to understand the latest technical challenges and the strategy of each players. Yole’s analysts identified strong investments in this sector. Competition is fierce and lot of announcements related to innovative technologies and investments have been made towards the media community, all year long…

PRESS RELEASE: ENGLISH VERSION - CHINESE VERSION - GERMAN VERSION

ADVANCED PACKAGING  - YOLE DEVELOPPEMENT & NCAP CHINA

Apr. 4 - Advanced Packaging: game-changer for semiconductor revolution

Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, AI & HPC … The market today is dominated by large IDMs , such as Intel and Samsung, top 4 global OSATs and foundry with packaging house - TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, Fan-Out packaging, 3D TSV and more… to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.
A few years ago, Yole Développement (Yole) and NCAP China decided to create a unique place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities.
Today, both partners confirm their success with the 5th Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry…

PRESS RELEASE: ENGLISH VERSION - CHINESE VERSION

MEMORY - YOLE GROUP OF COMPANIES 

Mar. 27 - 2018 DRAM & NAND markets: the end of an incredible multi-year rally

The combined DRAM and NAND memory markets experienced a period of extraordinary growth over the past several years, driven by important megatrends including mobility, cloud computing, AI , and IoT. Without a doubt, these megatrends have had a significant impact on the semiconductor industry, especially the memory markets.
Today, Yole Développement (Yole) announces a US$ 165 billion stand-alone memory market in 2018, with more than US$160 billion attributable to the DRAM and NAND market segments. Yole anticipates that long-term demand, driven by these megatrends, will result in memory continuing to increase its share of the overall semiconductor market. In addition to growing demand, prudent supply management from the industry leaders (e.g. Samsung, Micron, etc.) over the past two years enabled combined DRAM and NAND revenue growth of 107%, up from $78 billion in 2016…

PRESS RELEASE

RF ELECTRONICS - YOLE GROUP OF COMPANIES 

Mar. 25 - The 5G revolution is pushing innovations for RF front-end SiP

Without doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the RF front-end interacts in-between the network and the modem. The new RF bands pose so big challenges for the industry. The megatrends are today directly impacting the semiconductor and the advanced packaging industries and 5G is of course part of them.
“5G will bring more packaging business for OSATs”, asserts Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea...

PRESS RELEASE

MEMS & SENSORS - YOLE DEVELOPPEMENT & HILLCREST LABS

Mar. 14 - Using IMUs & sensor fusion to unlock smarter motion sensing
Hillcrest Labs and Yole Développement to host live webcast - Register today, click: LINK
March 26 at 9:00 AM PDT | 12:00 PM EDT | 5:00 PM CET

Hillcrest Labs, an InterDigital, Inc. company (NASDAQ: IDCC), and Yole Développement (Yole) have announced a free webinar on how to unlock the power of using IMUs (inertial measurement units) to deliver smarter motion sensing.
Webinar program and registration can be found here: LINK
Today, sensors are nearly everywhere, and requirements are becoming more and more demanding. It isn’t a stretch to say that the sensors of the future, when augmenting our reality with smart devices, can greatly improve our daily life.

PRESS RELEASE

IMAGING - YOLE GROUP OF COMPANIES

Mar. 17 - The camera module industry, a dynamic and innovative ecosystem

Despite headwinds the CCM market remains highly attractive,” states Pierre Cambou, Activity Leader at Yole Développement (Yole). The camera module industry has reached a new stage in its development. With US$27.1 billion of global revenues generated in 2018, the market maintains a 9.1% CAGR for the next 5 years. This industry, which covers image sensors, lenses, voice coil motors, illuminators and camera assemblies, is showing an impressive US$45.7 billion market by 2024. The overall growth is a combination of mega trends monitored by Yole Group companies including Yole and System Plus Consulting.
Both partners combine their expertise to deliver their vision of the CCM market and technology trends with two significant reports, Status of the Camera Module Industry and Mobile Camera Module Comparison...

PRESS RELEASE

SOFTWARE & COMPUTING - YOLE DEVELOPPEMENT

Mar. 6 - AI for autonomy: automotive is leading the way

In 2018, only robotic vehicles could claim to possess in-car AI. The associated computing market, driven by computers equivalent to what is found in datacenters and associated with rather low volumes, brought the computing market to US$156 million in 2018. Over the next 10 years, with the development of robo-taxis and shuttles, this market will remain the main revenue generator for AI in automotive, with US$9 billion in total computing revenue expected in 2028, announces Yole Développement (Yole) in its latest software & computing report, Artificial Intelligence Computing for Automotive report...

PRESS RELEASE

COMPOUND SEMI. - YOLE GROUP OF COMPANIES

Mar. 4 - SiC adoption is accelerating: is the industrial supply chain ready?

“The 2016-2018 period has been crucial for the whole SiC industry,” asserts Rémi Comyn, PhD., Patent & Technology Analyst at Knowmade, the Technology Intelligence and IP strategy consulting company. “SiC MOSFETs, commercially available for several years, are gaining the confidence of numerous customers and have clearly begun to penetrate into different applications”.
The IP landscape confirms the trend with the strong leadership of the Japanese companies, the entrance of the Chinese players, as well as an impressive penetration rate within the automotive industry...

PRESS RELEASES: ENGLISH - CHINESE - JAPANESE

ADVANCED PACKAGING - YOLE DEVELOPPEMENT & NCAP CHINA

Feb. 14 - Advanced packaging: at the heart of innovation
Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China

The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the key words. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are step by step changing our world. Big data, AI , 5G, HPC , IoT , smart automotive, industry 4.0, datacenters and more…, all mega-trends becoming part of our day to day life, with a direct impact on the semiconductor industry and its supply chain. But not only… In its latest report, Status of the Advanced Packaging Industry, Yole predicts an impressive US$39 billion advanced packaging market in 2023 with 7% CAGR… NCAP CHINA and Yole build an innovative program fully dedicated to the advanced packaging industry: the Advanced Packaging & System Integration Technology Symposium takes place in Shanghai, China, from April 22 to 23, 2019, prior to NEPCON China 2019....

PRESS RELEASES: ENGLISH - CHINESE

RF ELECTRONICS - YOLE DEVELOPPEMENT

Feb. 13 | Who is leading the RF GaN IP landscape?

The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape... In 2017-2018, the defense sector accounts for more than 35% of the total GaN RF market, and the global defense market shows no signs of slowing down. “We believe this important GaN market segment will continue growing along with GaN’s overall penetration rate,” asserts Hong Lin, PhD. Senior Technology & Market Analyst at Yole Développement (Yole),part of Yole Group of Companies.
Under this dynamic ecosystem, Yole’s partner, Knowmade, has deeply analyzed the RF GaN IP landscape and proposes today a dedicated report, RF GaN 2019 - patent landscape analysis. ...

PRESS RELEASES: ENGLISH - JAPANESE

POWER ELECTRONICS - YOLE DEVELOPPEMENT

Feb. 11 | Power GaN: who is part of the playground?

Eight years have passed since the first commercialized power GaN device. People in the power electronics industry are becoming increasingly familiar with the names of start-ups that are actively promoting GaN technology. Efficient Power Conversion (EPC), GaN Systems, Transphorm or Navitas, in addition to the power electronics leaders, Infineon Technologies and ON Semiconductor are also highly involved in the development of GaN technology. Moreover, not surprisingly, the list of GaN start-up players is getting longer over the years: Exagan, GaNPower International or Tagore Technology are also offering power GaN products.
Under this dynamic ecosystem, Yole Développement (Yole) and its partners EPC and SEMI are organizing a conference dedicated to the power GaN industry...

PRESS RELEASES: ENGLISH - GERMAN - CHINESE

ADVANCED PACKAGING - YOLE GROUP OF COMPANIES

Feb. 7 | High performance computing, artificial intelligence and datacenter: the 2.5D & 3D stacking technologies playground

“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU , FPGA , and CIS , are intended for the high/mid and low-end market segments.
Hardware like HBM and CIS comprise the majority of TSV’s revenue. The overall stacking technologies market will exceed US$5.5 billion in 2023 with a CAGR of 27%, announces Yole it its latest advanced packaging report, 2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates report...  

FULL PRESS RELEASE

ADVANCED PACKAGING - YOLE DEVELOPPEMENT

Jan. 31 | Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for production successfully in 2018.”
Under this dynamic context, advanced packaging companies are re-defining strategies to improve their market positioning or maintain their leadership. As a consequence, the supply chain is directly impacted and business models are thereby evolving. The Fan-Out packaging landscape of today is more fragmented than ever…
Yole Group of Companies including Yole and System Plus Consulting pursue its investigations towards the advanced packaging technologies and propose a significant collection of reports dedicated to Fan-Out.

FULL PRESS RELEASE

IMAGING - YOLE DEVELOPPEMENT

Jan. 28 | Uncooled IR sensing market: a virtuous cycle

2018 could be the year when the uncooled infrared imager and detector market reaches a tipping point with the involvement of big companies. As a consequence, the industry is showing impressive volumes and CAGR . “The uncooled IR detector and imager market looks promising,” confirm Yole Développement’s analysts. They announce an annual growth of 7% in value over the 2018-2024 period. For microbolometers, numerous commercial applications have driven the imager market growth. These include thermography, surveillance, PVS and firefighting. Most noticeably, shipments exceeded a million units in 2017, mostly due to FLIR’s Lepton core and SEEK Thermal’s success, heading to two million units in 2021!  

FULL PRESS RELEASE

For more information about the Uncooled Imaging Forum, 2019 edition, please contact: Julie Robert, Marketing & Communication Coordinator.

COMPOUND SEMICONDUCTOR  - YOLE GROUP OF COMPANIES

Jan. 28 | InP market is driven by the photonic sector with fiber optical applications for telecom & datacom

The InP wafer market is today dominated by the high-speed fiber optic communication market, as InP is capable of emission and detection in wavelengths above 1000 nm. The InP wafer market is so largely impacted by the photonics market, especially driven by datacom and telecom applications: each market segment is using InP as a substrate for both laser diodes and photo diodes in optical transceivers. Driven by the 5G arrival and the impressive growth of datacom business, the InP wafer and epiwafer are showing a strong attractiveness. Yole Développement (Yole) announces a US$172 million market by 2024, with a 14% CAGR between 2018 and 2024... 

FULL PRESS RELEASE

MEMORY - YOLE GROUP OF COMPANIES

Jan. 14 | ENVM mass adoption: players, challenges and strategies

Emerging non-volatile memory (NVM) was long restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. But in 2015, after more than 15 years in development, the first PCM-based technology for storage-class memory applications was presented by Micron and Intel: its name, 3D XPoint. However, it took these companies another two years before introducing their first commercial products. Two years after, Intel introduced Optane SSDs and storage accelerators. Developments should not stop there as persistent memory modules, the Optane DIMMs are expected in 2019.
“3D XPoint sales have finally accelerated thanks to Intel’s dominant position in the enterprise processor business,”
comments Simone Bertolazzi, PhD, Technology & Market Analyst at Yole Développement (Yole).Optane DIMMs will be sold in combination with the latest generation of Intel’s Xeon server processors.

FULL PRESS RELEASE

RF ELECTRONICS - YOLE DEVELOPPEMENT

Jan. 14 | RF electronics for IoT: the value is in data transmission, processing, and data usage

The challenge for RF electronics manufacturers to secure value in the IoT industry stays relevant today, announces the market research and strategy consulting company Yole Développement (Yole). IoT is often described as a wireless network of electronics-based components. RF, part of an IoT device is thus extremely important as it is linked to critical characteristics of the product, such as power consumption, data throughput or security… Silicon technologies linked to the IoT and dedicated to currently commercial protocols have long been developed. They are therefore mature and available. Kits embedding all discrete RF components on a single PCB have also appeared, such as STMicroelectronics’ STM32 node or the Hager Group’s Hager Smart RF Module...  

FULL PRESS RELEASE