2019 Press Releases

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FEBRUARY 14 :  ADVANCED PACKAGING - YOLE DEVELOPPEMENT & NCAP CHINA

Advanced packaging: at the heart of innovation
Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China

The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the key words. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are step by step changing our world. Big data, AI , 5G, HPC , IoT , smart automotive, industry 4.0, datacenters and more…, all mega-trends becoming part of our day to day life, with a direct impact on the semiconductor industry and its supply chain. But not only… In its latest report, Status of the Advanced Packaging Industry, Yole predicts an impressive US$39 billion advanced packaging market in 2023 with 7% CAGR… NCAP CHINA and Yole build an innovative program fully dedicated to the advanced packaging industry: the Advanced Packaging & System Integration Technology Symposium takes place in Shanghai, China, from April 22 to 23, 2019, prior to NEPCON China 2019....

PRESS RELEASES: ENGLISH - CHINESE

FEBRUARY 13 :  RF ELECTRONICS - YOLE DEVELOPPEMENT

Who is leading the RF GaN IP landscape?

The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape... In 2017-2018, the defense sector accounts for more than 35% of the total GaN RF market, and the global defense market shows no signs of slowing down. “We believe this important GaN market segment will continue growing along with GaN’s overall penetration rate,” asserts Hong Lin, PhD. Senior Technology & Market Analyst at Yole Développement (Yole),part of Yole Group of Companies.
Under this dynamic ecosystem, Yole’s partner, Knowmade, has deeply analyzed the RF GaN IP landscape and proposes today a dedicated report, RF GaN 2019 - patent landscape analysis. ...

PRESS RELEASES: ENGLISH - JAPANESE

FEBRUARY 11 :  POWER ELECTRONICS - YOLE DEVELOPPEMENT

Power GaN: who is part of the playground?

Eight years have passed since the first commercialized power GaN device. People in the power electronics industry are becoming increasingly familiar with the names of start-ups that are actively promoting GaN technology. Efficient Power Conversion (EPC), GaN Systems, Transphorm or Navitas, in addition to the power electronics leaders, Infineon Technologies and ON Semiconductor are also highly involved in the development of GaN technology. Moreover, not surprisingly, the list of GaN start-up players is getting longer over the years: Exagan, GaNPower International or Tagore Technology are also offering power GaN products.
Under this dynamic ecosystem, Yole Développement (Yole) and its partners EPC and SEMI are organizing a conference dedicated to the power GaN industry...

PRESS RELEASES: ENGLISH - GERMAN - CHINESE

FEBRUARY 7 :  ADVANCED PACKAGING - YOLE GROUP OF COMPANIES

High performance computing, artificial intelligence and datacenter: the 2.5D & 3D stacking technologies playground

“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU , FPGA , and CIS , are intended for the high/mid and low-end market segments.
Hardware like HBM and CIS comprise the majority of TSV’s revenue. The overall stacking technologies market will exceed US$5.5 billion in 2023 with a CAGR of 27%, announces Yole it its latest advanced packaging report, 2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates report...  

FULL PRESS RELEASE

MEDIA CONTACT
Sandrine Leroy, Press Relations & Corporate Communication Manager (Email: leroy@yole.fr / Phone: +33 (0) 472 83 01 89).

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ADVANCED PACKAGING - YOLE DEVELOPPEMENT

Jan. 31 | Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for production successfully in 2018.”
Under this dynamic context, advanced packaging companies are re-defining strategies to improve their market positioning or maintain their leadership. As a consequence, the supply chain is directly impacted and business models are thereby evolving. The Fan-Out packaging landscape of today is more fragmented than ever…
Yole Group of Companies including Yole and System Plus Consulting pursue its investigations towards the advanced packaging technologies and propose a significant collection of reports dedicated to Fan-Out.

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IMAGING - YOLE DEVELOPPEMENT

Jan. 28 | Uncooled IR sensing market: a virtuous cycle

2018 could be the year when the uncooled infrared imager and detector market reaches a tipping point with the involvement of big companies. As a consequence, the industry is showing impressive volumes and CAGR . “The uncooled IR detector and imager market looks promising,” confirm Yole Développement’s analysts. They announce an annual growth of 7% in value over the 2018-2024 period. For microbolometers, numerous commercial applications have driven the imager market growth. These include thermography, surveillance, PVS and firefighting. Most noticeably, shipments exceeded a million units in 2017, mostly due to FLIR’s Lepton core and SEEK Thermal’s success, heading to two million units in 2021!  

FULL PRESS RELEASE

For more information about the Uncooled Imaging Forum, 2019 edition, please contact: Julie Robert, Marketing & Communication Coordinator.

COMPOUND SEMICONDUCTOR  - YOLE GROUP OF COMPANIES

Jan. 28 | InP market is driven by the photonic sector with fiber optical applications for telecom & datacom

The InP wafer market is today dominated by the high-speed fiber optic communication market, as InP is capable of emission and detection in wavelengths above 1000 nm. The InP wafer market is so largely impacted by the photonics market, especially driven by datacom and telecom applications: each market segment is using InP as a substrate for both laser diodes and photo diodes in optical transceivers. Driven by the 5G arrival and the impressive growth of datacom business, the InP wafer and epiwafer are showing a strong attractiveness. Yole Développement (Yole) announces a US$172 million market by 2024, with a 14% CAGR between 2018 and 2024... 

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MEMORY - YOLE GROUP OF COMPANIES

Jan. 14 | ENVM mass adoption: players, challenges and strategies

Emerging non-volatile memory (NVM) was long restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. But in 2015, after more than 15 years in development, the first PCM-based technology for storage-class memory applications was presented by Micron and Intel: its name, 3D XPoint. However, it took these companies another two years before introducing their first commercial products. Two years after, Intel introduced Optane SSDs and storage accelerators. Developments should not stop there as persistent memory modules, the Optane DIMMs are expected in 2019.
“3D XPoint sales have finally accelerated thanks to Intel’s dominant position in the enterprise processor business,”
comments Simone Bertolazzi, PhD, Technology & Market Analyst at Yole Développement (Yole).Optane DIMMs will be sold in combination with the latest generation of Intel’s Xeon server processors.

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RF ELECTRONICS - YOLE DEVELOPPEMENT

Jan. 14 | RF electronics for IoT: the value is in data transmission, processing, and data usage

The challenge for RF electronics manufacturers to secure value in the IoT industry stays relevant today, announces the market research and strategy consulting company Yole Développement (Yole). IoT is often described as a wireless network of electronics-based components. RF, part of an IoT device is thus extremely important as it is linked to critical characteristics of the product, such as power consumption, data throughput or security… Silicon technologies linked to the IoT and dedicated to currently commercial protocols have long been developed. They are therefore mature and available. Kits embedding all discrete RF components on a single PCB have also appeared, such as STMicroelectronics’ STM32 node or the Hager Group’s Hager Smart RF Module...  

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