2019 Press Releases

MEDIA CENTER


LATEST HEADLINES

APRIL 4   MEMS & SENSORS - YOLE GROUP OF COMPANIES 

LiDAR industry: high expectations for autonomous driving

The LiDAR market reached US$1.3 billion in 2018, announces Yole Développement (Yole). For the 2nd time, the market research and strategy consulting company, Yole releases a dedicated LiDAR technology and market report to point out the industry evolution and give insights about the latest innovations.
With its Lidar for Automotive & Industrial Applications report, the company pursues its investigations to understand the latest technical challenges and the strategy of each players. Yole’s analysts identified strong investments in this sector. Competition is fierce and lot of announcements related to innovative technologies and investments have been made towards the media community, all year long…

PRESS RELEASE: ENGLISH VERSION - CHINESE VERSION - GERMAN VERSION

APRIL 4   ADVANCED PACKAGING  - YOLE DEVELOPPEMENT & NCAP CHINA

Advanced Packaging: game-changer for semiconductor revolution

Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, AI & HPC … The market today is dominated by large IDMs , such as Intel and Samsung, top 4 global OSATs and foundry with packaging house - TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, Fan-Out packaging, 3D TSV and more… to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.
A few years ago, Yole Développement (Yole) and NCAP China decided to create a unique place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities.
Today, both partners confirm their success with the 5th Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry…

PRESS RELEASE: ENGLISH VERSION - CHINESE VERSION

MEDIA CONTACT
Sandrine Leroy, Press Relations & Corporate Communication Manager (Email: leroy@yole.fr / Phone: +33 (0) 472 83 01 89).

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MEMORY - YOLE GROUP OF COMPANIES 

Mar. 27 - 2018 DRAM & NAND markets: the end of an incredible multi-year rally

The combined DRAM and NAND memory markets experienced a period of extraordinary growth over the past several years, driven by important megatrends including mobility, cloud computing, AI , and IoT. Without a doubt, these megatrends have had a significant impact on the semiconductor industry, especially the memory markets.
Today, Yole Développement (Yole) announces a US$ 165 billion stand-alone memory market in 2018, with more than US$160 billion attributable to the DRAM and NAND market segments. Yole anticipates that long-term demand, driven by these megatrends, will result in memory continuing to increase its share of the overall semiconductor market. In addition to growing demand, prudent supply management from the industry leaders (e.g. Samsung, Micron, etc.) over the past two years enabled combined DRAM and NAND revenue growth of 107%, up from $78 billion in 2016…

PRESS RELEASE

RF ELECTRONICS - YOLE GROUP OF COMPANIES 

Mar. 25 - The 5G revolution is pushing innovations for RF front-end SiP

Without doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the RF front-end interacts in-between the network and the modem. The new RF bands pose so big challenges for the industry. The megatrends are today directly impacting the semiconductor and the advanced packaging industries and 5G is of course part of them.
“5G will bring more packaging business for OSATs”, asserts Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea...

PRESS RELEASE

MEMS & SENSORS - YOLE DEVELOPPEMENT & HILLCREST LABS

Mar. 14 - Using IMUs & sensor fusion to unlock smarter motion sensing
Hillcrest Labs and Yole Développement to host live webcast - Register today, click: LINK
March 26 at 9:00 AM PDT | 12:00 PM EDT | 5:00 PM CET

Hillcrest Labs, an InterDigital, Inc. company (NASDAQ: IDCC), and Yole Développement (Yole) have announced a free webinar on how to unlock the power of using IMUs (inertial measurement units) to deliver smarter motion sensing.
Webinar program and registration can be found here: LINK
Today, sensors are nearly everywhere, and requirements are becoming more and more demanding. It isn’t a stretch to say that the sensors of the future, when augmenting our reality with smart devices, can greatly improve our daily life.

PRESS RELEASE

IMAGING - YOLE GROUP OF COMPANIES

Mar. 17 - The camera module industry, a dynamic and innovative ecosystem

Despite headwinds the CCM market remains highly attractive,” states Pierre Cambou, Activity Leader at Yole Développement (Yole). The camera module industry has reached a new stage in its development. With US$27.1 billion of global revenues generated in 2018, the market maintains a 9.1% CAGR for the next 5 years. This industry, which covers image sensors, lenses, voice coil motors, illuminators and camera assemblies, is showing an impressive US$45.7 billion market by 2024. The overall growth is a combination of mega trends monitored by Yole Group companies including Yole and System Plus Consulting.
Both partners combine their expertise to deliver their vision of the CCM market and technology trends with two significant reports, Status of the Camera Module Industry and Mobile Camera Module Comparison...

PRESS RELEASE

SOFTWARE & COMPUTING - YOLE DEVELOPPEMENT

Mar. 6 - AI for autonomy: automotive is leading the way

In 2018, only robotic vehicles could claim to possess in-car AI. The associated computing market, driven by computers equivalent to what is found in datacenters and associated with rather low volumes, brought the computing market to US$156 million in 2018. Over the next 10 years, with the development of robo-taxis and shuttles, this market will remain the main revenue generator for AI in automotive, with US$9 billion in total computing revenue expected in 2028, announces Yole Développement (Yole) in its latest software & computing report, Artificial Intelligence Computing for Automotive report...

PRESS RELEASE

COMPOUND SEMI. - YOLE GROUP OF COMPANIES

Mar. 4 - SiC adoption is accelerating: is the industrial supply chain ready?

“The 2016-2018 period has been crucial for the whole SiC industry,” asserts Rémi Comyn, PhD., Patent & Technology Analyst at Knowmade, the Technology Intelligence and IP strategy consulting company. “SiC MOSFETs, commercially available for several years, are gaining the confidence of numerous customers and have clearly begun to penetrate into different applications”.
The IP landscape confirms the trend with the strong leadership of the Japanese companies, the entrance of the Chinese players, as well as an impressive penetration rate within the automotive industry...

PRESS RELEASES: ENGLISH - CHINESE - JAPANESE

ADVANCED PACKAGING - YOLE DEVELOPPEMENT & NCAP CHINA

Feb. 14 - Advanced packaging: at the heart of innovation
Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China

The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the key words. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are step by step changing our world. Big data, AI , 5G, HPC , IoT , smart automotive, industry 4.0, datacenters and more…, all mega-trends becoming part of our day to day life, with a direct impact on the semiconductor industry and its supply chain. But not only… In its latest report, Status of the Advanced Packaging Industry, Yole predicts an impressive US$39 billion advanced packaging market in 2023 with 7% CAGR… NCAP CHINA and Yole build an innovative program fully dedicated to the advanced packaging industry: the Advanced Packaging & System Integration Technology Symposium takes place in Shanghai, China, from April 22 to 23, 2019, prior to NEPCON China 2019....

PRESS RELEASES: ENGLISH - CHINESE

RF ELECTRONICS - YOLE DEVELOPPEMENT

Feb. 13 | Who is leading the RF GaN IP landscape?

The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape... In 2017-2018, the defense sector accounts for more than 35% of the total GaN RF market, and the global defense market shows no signs of slowing down. “We believe this important GaN market segment will continue growing along with GaN’s overall penetration rate,” asserts Hong Lin, PhD. Senior Technology & Market Analyst at Yole Développement (Yole),part of Yole Group of Companies.
Under this dynamic ecosystem, Yole’s partner, Knowmade, has deeply analyzed the RF GaN IP landscape and proposes today a dedicated report, RF GaN 2019 - patent landscape analysis. ...

PRESS RELEASES: ENGLISH - JAPANESE

POWER ELECTRONICS - YOLE DEVELOPPEMENT

Feb. 11 | Power GaN: who is part of the playground?

Eight years have passed since the first commercialized power GaN device. People in the power electronics industry are becoming increasingly familiar with the names of start-ups that are actively promoting GaN technology. Efficient Power Conversion (EPC), GaN Systems, Transphorm or Navitas, in addition to the power electronics leaders, Infineon Technologies and ON Semiconductor are also highly involved in the development of GaN technology. Moreover, not surprisingly, the list of GaN start-up players is getting longer over the years: Exagan, GaNPower International or Tagore Technology are also offering power GaN products.
Under this dynamic ecosystem, Yole Développement (Yole) and its partners EPC and SEMI are organizing a conference dedicated to the power GaN industry...

PRESS RELEASES: ENGLISH - GERMAN - CHINESE

ADVANCED PACKAGING - YOLE GROUP OF COMPANIES

Feb. 7 | High performance computing, artificial intelligence and datacenter: the 2.5D & 3D stacking technologies playground

“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU , FPGA , and CIS , are intended for the high/mid and low-end market segments.
Hardware like HBM and CIS comprise the majority of TSV’s revenue. The overall stacking technologies market will exceed US$5.5 billion in 2023 with a CAGR of 27%, announces Yole it its latest advanced packaging report, 2.5D / 3D TSV & Wafer Level Stacking: Technology & Market Updates report...  

FULL PRESS RELEASE

ADVANCED PACKAGING - YOLE DEVELOPPEMENT

Jan. 31 | Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for production successfully in 2018.”
Under this dynamic context, advanced packaging companies are re-defining strategies to improve their market positioning or maintain their leadership. As a consequence, the supply chain is directly impacted and business models are thereby evolving. The Fan-Out packaging landscape of today is more fragmented than ever…
Yole Group of Companies including Yole and System Plus Consulting pursue its investigations towards the advanced packaging technologies and propose a significant collection of reports dedicated to Fan-Out.

FULL PRESS RELEASE

IMAGING - YOLE DEVELOPPEMENT

Jan. 28 | Uncooled IR sensing market: a virtuous cycle

2018 could be the year when the uncooled infrared imager and detector market reaches a tipping point with the involvement of big companies. As a consequence, the industry is showing impressive volumes and CAGR . “The uncooled IR detector and imager market looks promising,” confirm Yole Développement’s analysts. They announce an annual growth of 7% in value over the 2018-2024 period. For microbolometers, numerous commercial applications have driven the imager market growth. These include thermography, surveillance, PVS and firefighting. Most noticeably, shipments exceeded a million units in 2017, mostly due to FLIR’s Lepton core and SEEK Thermal’s success, heading to two million units in 2021!  

FULL PRESS RELEASE

For more information about the Uncooled Imaging Forum, 2019 edition, please contact: Julie Robert, Marketing & Communication Coordinator.

COMPOUND SEMICONDUCTOR  - YOLE GROUP OF COMPANIES

Jan. 28 | InP market is driven by the photonic sector with fiber optical applications for telecom & datacom

The InP wafer market is today dominated by the high-speed fiber optic communication market, as InP is capable of emission and detection in wavelengths above 1000 nm. The InP wafer market is so largely impacted by the photonics market, especially driven by datacom and telecom applications: each market segment is using InP as a substrate for both laser diodes and photo diodes in optical transceivers. Driven by the 5G arrival and the impressive growth of datacom business, the InP wafer and epiwafer are showing a strong attractiveness. Yole Développement (Yole) announces a US$172 million market by 2024, with a 14% CAGR between 2018 and 2024... 

FULL PRESS RELEASE

MEMORY - YOLE GROUP OF COMPANIES

Jan. 14 | ENVM mass adoption: players, challenges and strategies

Emerging non-volatile memory (NVM) was long restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. But in 2015, after more than 15 years in development, the first PCM-based technology for storage-class memory applications was presented by Micron and Intel: its name, 3D XPoint. However, it took these companies another two years before introducing their first commercial products. Two years after, Intel introduced Optane SSDs and storage accelerators. Developments should not stop there as persistent memory modules, the Optane DIMMs are expected in 2019.
“3D XPoint sales have finally accelerated thanks to Intel’s dominant position in the enterprise processor business,”
comments Simone Bertolazzi, PhD, Technology & Market Analyst at Yole Développement (Yole).Optane DIMMs will be sold in combination with the latest generation of Intel’s Xeon server processors.

FULL PRESS RELEASE

RF ELECTRONICS - YOLE DEVELOPPEMENT

Jan. 14 | RF electronics for IoT: the value is in data transmission, processing, and data usage

The challenge for RF electronics manufacturers to secure value in the IoT industry stays relevant today, announces the market research and strategy consulting company Yole Développement (Yole). IoT is often described as a wireless network of electronics-based components. RF, part of an IoT device is thus extremely important as it is linked to critical characteristics of the product, such as power consumption, data throughput or security… Silicon technologies linked to the IoT and dedicated to currently commercial protocols have long been developed. They are therefore mature and available. Kits embedding all discrete RF components on a single PCB have also appeared, such as STMicroelectronics’ STM32 node or the Hager Group’s Hager Smart RF Module...  

FULL PRESS RELEASE